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Showing results 112334 to 112353 of 116409
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Issue Date
Title
Author(s)
2012
W band passive circuits design using substrate integrated waveguide (SIW)
Wang, Youzi.
2012
W(CO)5(L)-catalyzed cyclization of α-alkynyl-β-dicarbonyl derivatives : synthesis of methylenelactones, furans, and methylenecyclopentanes
Meng, Xiangjian.
;
Kim, Sunggak.
1996
W(h)ither national sovereignty : cultural identities in a global context
Sreberny-Mohammadi, Annabelle
2018
A W-Band backward-wave oscillator based on planar helix slow wave structure
Kumar, Ajith M. M.
;
Aditya, Sheel
;
Wang, Shaomeng
2012
W-band monopole antenna-in-system design approached on molding compound material
Jin, Cheng
;
Li, Rui
;
Zhang, Xiaowu
;
Alphones, Arokiaswami
2013
W-band rectangular ring-bar structure with straight-edge connections
Aditya, Sheel
;
Chua, Ciersiang
;
Lau, Yue Ying
2018
A W-band switch-less Dicke receiver for millimeter-wave imaging in 65nm CMOS
Feng, Guangyin
;
Yi, Xiang
;
Meng, Fanyi
;
Boon, Chirn Chye
2021
W-type normal dispersion thulium-doped fiber-based high-energy all-fiber femtosecond laser at 1.7 µm
Chen, Shaoxiang
;
Chen, Yuhao
;
Liu, Kun
;
Sidharthan, Raghuraman
;
Li, Huizi
;
Chang, Chen Jian
;
Wang, Qi Jie
;
Tang, Dingyuan
;
Yoo, Seongwoo
2017
W/Cu thin film infrared reflector for TiNxOy based selective solar absorber with high thermal stability
Liu, Y. C.
;
Liu, Z.
;
Yang, H. Y.
;
Zhang, Jun
;
Chen, Tupei
2014
Wabi
Sim, Shen-Wei
2021
WaC : first results on practical side-channel attacks on commercial machine learning accelerator
Won, Yoo-Seung
;
Chatterjee, Soham
;
Jap, Dirmanto
;
Basu, Arindam
;
Bhasin, Shivam
2013
Wafer fabrication cycle time report
Cheng, Hao Fen.
2000
Wafer level electromigration reliability study of deep submicron via for multilevel metallization
Loh, Wye Boon.
2013
Wafer level silicon mould fabrication and imprinting of high density microstructures
Wong, T. I.
;
Ong, H. Y.
;
Lu, H. J.
;
Tse, M. S.
;
Quan, C. G.
;
Ng, S. H.
;
Zhou, X.
2012
Wafer-level fine pitch Cu-Cu bonding for 3-D stacking of integrated circuits
Peng, Lan
2012
Wafer-level hermetic packaging of 3D microsystems with low-temperature Cu-to-Cu thermo-compression bonding and its reliability
Peng, L.
;
Fan, Ji
;
Li, Kwok Hung
;
Tan, Chuan Seng
2002
Wafer-level isothermal electromigration study on deep sub-micron interconnect metallization
Lim, Yeow Kheng.
2022
Wafer-scale demonstration of low-loss (∼0.43 dB/cm), high-bandwidth (>38 GHz), silicon photonics platform operating at the C-band
Sia, Brian Jia Xu
;
Li, Xiang
;
Wang, Jiawei
;
Wang, Wanjun
;
Qiao, Zhongliang
;
Guo, Xin
;
Lee, Chee Wei
;
Sasidharan, Ashesh
;
Gunasagar, S.
;
Littlejohns, Callum G.
;
Liu, Chongyang
;
Reed, Graham T.
;
Ang, Kian Siong
;
Wang, Hong
2022
Wafer-scale deposition of transition metal Dichalcogenide film
Ang, Nicole Ru Xuan
2015
A wafer-scale graphene and ferroelectric multilayer for flexible and fast-switched modulation applications
Zhu, Minmin
;
Wu, Jing
;
Du, Zehui
;
Tay, Roland Yingjie
;
Li, Hongling
;
Özyilmaz, Barbarous
;
Teo, Edwin Hang Tong