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Department of Mechanical Engineering, National University of Singapore
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Showing results 1 to 1 of 1
Issue Date
Title
Author(s)
2008
A new creep model for SnAgCu lead-free composite solders : incorporating back stress
Nai, S. M. L.
;
Xu, L. Y.
;
Zhang, S. R.
;
Han, Yongdian
;
Jing, Hongyang
;
Tan, Cher Ming
;
Wei, Jun