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Browsing by Author "Gan, Chee Lip."

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Browsing by Author "Gan, Chee Lip."

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Date Title Author Type
2010
Controlled synthesis of copper-silicide nanostructures.
Li, Shaozhou.; Cai, Hui.; Gan, Chee Lip.; Guo, Jun.; Dong, Zhili.; Ma, Jan.
Journal Article
2012
Effect of copper TSV annealing on via protrusion for TSV wafer fabrication.
Heryanto, A.; Putra, W. N.; Trigg, A.; Gao, S.; Kwon, W. S.; Che, F. X.; Ang, X. F.; Wei, J.; Made, Riko I.; Gan, Chee Lip.; Pey, Kin Leong.
Journal Article
2013
Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits.
Made, Riko I.; Peng, Lan.; Li, Hong Yu.; Gan, Chee Lip.; Tan, Chuan Seng.
Journal Article
2007
Enhanced photoluminescence of ZnO/Er2O3 core-shell structure nanorods synthesized by pulsed laser deposition.
Li, Shaozhou.; Gan, Chee Lip.; Cai, Hui.; Yuan, C. L.; Guo, Jun.; Lee, Pooi See.; Ma, Jan.
Journal Article
2009
Experimental characterization and modeling of the contact resistance of Cu-Cu bonded interconnects.
Leong, H. L.; Gan, Chee Lip.; Made, Riko I.; Thompson, Carl V.; Pey, Kin Leong.; Li, H. Y.
Journal Article
2012
Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits.
Made, Riko I.; Gan, Chee Lip.; Yan, Li Ling.; Kor, Katherine Hwee Boon.; Chia, Hong Ling.; Pey, Kin Leong.; Thompson, Carl V.
Journal Article
2011
Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits.
Made, Riko I.; Gan, Chee Lip.; Yan, Liling.; Kor, Katherine Hwee Boon.; Chia, Hong Ling.; Pey, Kin Leong.; Thompson, Carl V.
Journal Article
2013
Improved mechanical and thermomechanical properties of alumina substrate via iron doping.
Made, Riko I.; Phua, Eric Jian Rong.; Pramana, Stevin Snellius.; Wong, Chee Cheong.; Chen, Zhong.; Tok, Alfred Ling Yoong.; Gan, Chee Lip.
Journal Article
2010
Modeling of electromigration induced contact resistance reduction of Cu-Cu bonded interface.
Made, Riko I.; Gan, Chee Lip.; Tan, Chuan Seng.
Journal Article
2010
Network-enhanced photoresponse time of Ge nanowire photodetectors.
Yan, Chaoyi.; Singh, Nandan.; Cai, Hui.; Gan, Chee Lip.; Lee, Pooi See.
Journal Article
2010
Photochemically controlled synthesis of anisotropic Au nanostructures : platelet-like Au nanorods and six-star Au nanoparticles.
Huang, Xiao.; Qi, Xiaoying.; Huang, Yizhong.; Li, Shaozhou.; Xue, Can.; Gan, Chee Lip.; Boey, Freddy Yin Chiang.; Zhang, Hua.
Journal Article
2012
Self-organization of a hybrid nanostructure consisting of a nanoneedle and nanodot.
Liu, Hai.; Wu, Junsheng.; Wang, Ying.; Chow, Chee Lap.; Liu, Qing.; Gan, Chee Lip.; Tang, Xiaohong.; Rawat, Rajdeep Singh.; Tan, Ooi Kiang.; Ma, Jan.; Huang, Yizhong.
Journal Article
2009
Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications.
Made, Riko I.; Gan, Chee Lip.; Yan, Li Ling.; Yu, Aibin.; Yoon, Seung Wook.; Lau, John H.; Lee, Chengkuo.
Journal Article
2008
Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications.
Made, Riko I.; Gan, Chee Lip.; Yan, Li Ling.; Yu, Aibin.; Yoon, Seung Wook.; Lau, John H.; Lee, Chengkuo.
Journal Article
2011
Study of the evolution of Cu-Cu bonding interface imperfection under direct current stressing for three dimensional integrated circuits.
Made, Riko I.; Lan, Peng.; Li, Hong Yu.; Gan, Chee Lip.; Tan, Chuan Seng.
Conference Paper
2010
Surface-induced synthesis and self-assembly of metal suprastructures.
Li, Shaozhou.; Huang, Xiao.; Li, Hai.; Cai, Hui.; Gan, Chee Lip.; Boey, Freddy Yin Chiang.; Zhang, Hua.
Journal Article