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Digital Repository - Nanyang Technological University
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Browsing by Author "Gan, Zhenghao."

Now showing items 1-9 of 9

Date	Title	Author	Type
2007	Analytical modeling of reservoir effect on electromigration in Cu interconnects.	Gan, Zhenghao.; Gusak, A. M.; Shao, W.; Chen, Zhong.; Mhaisalkar, S. G.; Zaporozhets, T.; Tu, K. N.	Journal Article
2004	Dynamic study of the physical processes in the intrinsic line electromigration of deep-submicron copper and aluminum interconnects.	Tan, Cher Ming.; Zhang, Guan.; Gan, Zhenghao.	Journal Article
2006	Effect of electron beam treatment on adhesion of Ta/polymeric low-k interface.	Gan, Zhenghao.; Chen, Zhong.; Mhaisalkar, S. G.; Damayanti, M.; Chen, Zhe.; Prasad, K.; Zhang, Sam.; Jiang, Ning.	Journal Article
2003	Failure mechanisms of aluminum bondpad peeling during thermosonic bonding.	Tan, Cher Ming.; Gan, Zhenghao.	Journal Article
2007	Fracture toughness measurement of thin films on compliant substrate using controlled buckling test.	Chen, Zhong.; Gan, Zhenghao.	Journal Article
2006	Modification of Ta/polymeric low-k interface by electron beam treatment.	Gan, Zhenghao.; Mhaisalkar, S. G.; Chen, Zhong.; Chen, Zhe.; Prasad, K.; Zhang, Sam.; Damayanti, M.; Jiang, Ning.	Journal Article
2003	Nondestructive void size determination in copper metallization under passivation.	Gan, Zhenghao.; Tan, Cher Ming.; Zhang, Guan.	Journal Article
2004	Study of interfacial adhesion energy of multilayered ULSI thin film structures using four-point bending test.	Gan, Zhenghao.; Mhaisalkar, S. G.; Chen, Zhong.; Zhang, Sam.; Chen, Zhe.; Prasad, K.	Journal Article
2003	Temperature and stress distribution in the SOI structure during fabrication.	Tan, Cher Ming.; Gan, Zhenghao.; Gao, Xiaofang.	Journal Article

Now showing items 1-9 of 9