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Browsing by Author "IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (15th:2008:Singapore)"

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Browsing by Author "IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (15th:2008:Singapore)"

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Date Title Author Type
2008
Statistical modeling of via redundancy effects on interconnect reliability.
Raghavan, Nagarajan.; Tan, Cher Ming.
Conference Paper