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Browsing by Author "Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International"

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Browsing by Author "Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International"

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Date Title Author Type
2011
Study of the evolution of Cu-Cu bonding interface imperfection under direct current stressing for three dimensional integrated circuits.
Made, Riko I.; Lan, Peng.; Li, Hong Yu.; Gan, Chee Lip.; Tan, Chuan Seng.
Conference Paper