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Browsing by Author "Pey, Kin Leong."

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Browsing by Author "Pey, Kin Leong."

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Date Title Author Type
2004
Characterization of the junction leakage of Ti-capped Ni-silicided junctions.
Toledo, N. G.; Lee, Pooi See.; Pey, Kin Leong.
Journal Article
2013
Charge transport in lightly reduced graphene oxide : a transport energy perspective.
Kajen, R. S.; Chandrasekhar, N.; Pey, Kin Leong.; Vijila, C.; Jaiswal, M.; Saravanan, S.; Ng, Andrew M. H.; Wong, C. P.; Loh, K. P.
Journal Article
2001
Comparative study of current-voltage characteristics of Ni and Ni(Pt)- alloy silicided p+/n diodes.
Chi, Dong Zhi.; Mangelinck, D.; Lahiri, S. K.; Lee, Pooi See.; Pey, Kin Leong.
Journal Article
2008
Demonstration of Schottky barrier NMOS transistors with erbium silicided source/drain and silicon nanowire channel.
Tan, Eu Jin.; Pey, Kin Leong.; Singh, Navab.; Lo, Guo-Qiang.; Chi, Dong Zhi.; Chin, Yoke King.; Hoe, Keat Mun.; Cui, Guangda.; Lee, Pooi See.
Journal Article
2012
Effect of copper TSV annealing on via protrusion for TSV wafer fabrication.
Heryanto, A.; Putra, W. N.; Trigg, A.; Gao, S.; Kwon, W. S.; Che, F. X.; Ang, X. F.; Wei, J.; Made, Riko I.; Gan, Chee Lip.; Pey, Kin Leong.
Journal Article
2002
Effect of ion implantation on layer inversion of Ni silicided poly-Si.
Lee, Pooi See.; Pey, Kin Leong.; Mangelinck, D.; Ding, J.; Chi, Dong Zhi.; Osipowicz, T.; Dai, J. Y.; Chan, L.
Journal Article
2005
Effect of Ti alloying in nickel silicide formation.
Setiawan, Y.; Lee, Pooi See.; Tan, C. W.; Pey, Kin Leong.
Journal Article
2005
Effects of Si(001) surface amorphization on ErSi2 thin film.
Tan, Eu Jin.; Kon, M. L.; Pey, Kin Leong.; Lee, Pooi See.; Zhang, Y. W.; Wang, W. D.; Chi, Dong Zhi.
Journal Article
2012
The electronic barrier height of silicon native oxides at different oxidation stages.
Qin, H. L.; Goh, K. E. J.; Troadec, C.; Bosman, M.; Pey, Kin Leong.
Journal Article
2009
Experimental characterization and modeling of the contact resistance of Cu-Cu bonded interconnects.
Leong, H. L.; Gan, Chee Lip.; Made, Riko I.; Thompson, Carl V.; Pey, Kin Leong.; Li, H. Y.
Journal Article
2011
Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits.
Made, Riko I.; Gan, Chee Lip.; Yan, Liling.; Kor, Katherine Hwee Boon.; Chia, Hong Ling.; Pey, Kin Leong.; Thompson, Carl V.
Journal Article
2012
Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits.
Made, Riko I.; Gan, Chee Lip.; Yan, Li Ling.; Kor, Katherine Hwee Boon.; Chia, Hong Ling.; Pey, Kin Leong.; Thompson, Carl V.
Journal Article
2006
Improved electrical performance of Erbium silicide Schottky diodes formed by pre-RTA amorphization of Si.
Tan, Eu Jin.; Pey, Kin Leong.; Chi, Dong Zhi.; Lee, Pooi See.; Tang, L. J.
Journal Article
2000
Improved NiSi salicide process using presilicide N2+ implant for MOSFETs.
Lee, Pooi See.; Pey, Kin Leong.; Mangelinck, D.; Ding, J.; Wee, A. T. S.; Chan, L.
Journal Article
2002
Interfacial reacions of Ni on Si1-xGex (x=0.2, 0.3) at low temperature by rapid thermal annealing.
Zhao, H. B.; Pey, Kin Leong.; Choi, W. K.; Chattopadhyay, Sujay.; Fitzgerald, E. A.; Antoniadis, D. A.; Lee, Pooi See.
Journal Article
2008
Laser-induced melt-mediated Ni(Pt) germanosilicide formation on condensed Si1-xGex/Si substrates.
Setiawan, Y.; Lee, Pooi See.; Balakumar, S.; Pey, Kin Leong.; Wang, X. C.
Journal Article
2007
Laser-induced Ni(Pt) germanosilicide formation through a self-limiting melting phenomenon on Si1-xGex/Si heterostructure.
Setiawan, Y.; Lee, Pooi See.; Pey, Kin Leong.; Wang, X. C.; Lim, G. C.; Tan, B. L.
Journal Article
2006
Laser induced Ni(Ti) silicide formation.
Setiawan, Y.; Lee, Pooi See.; Pey, Kin Leong.; Wang, X. C.; Lim, G. C.
Journal Article
2002
Layer inversion of Ni(Pt)Si on mixed phase Si films.
Lee, Pooi See.; Pey, Kin Leong.; Mangelinck, D.; Ding, J.; Osipowicz, T.; See, A.
Journal Article
2007
Materials and electrical characterization of Er(Si1-xGex)(2-y) films formed on Si1-xGex(001) (x=0-0.3) via rapid thermal annealing.
Tan, Eu Jin.; Pey, Kin Leong.; Chi, Dong Zhi.; Lee, Pooi See.; Setiawan, Y.; Hoe, K. M.
Journal Article