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Date	Title	Author	Type
2007	Critical temperatures in thermocompression gold stud bonding.	Zhang, G. G.; Ang, X. F.; Chen, Z.; Wong, Chee C.; Wei, J.	Journal Article
2010	Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads : a TEM study of interfacial evolution.	Xu, H.; Liu, C.; Silberschmidt, V. V.; Chen, Z.; Wei, J.; Sivakumar, M.	Journal Article
2008	Effect of chain length on low temperature gold-gold bonding by self assembled monolayers.	Ang, X. F.; Chen, Z.; Wong, Chee C.; Wei, J.	Journal Article
2012	Effect of copper TSV annealing on via protrusion for TSV wafer fabrication.	Heryanto, A.; Putra, W. N.; Trigg, A.; Gao, S.; Kwon, W. S.; Che, F. X.; Ang, X. F.; Wei, J.; Made, Riko I.; Gan, Chee Lip.; Pey, Kin Leong.	Journal Article
2007	Self-assembled monolayers for reduced temperature direct metal thermocompression bonding.	Ang, X. F.; Li, F. Y.; Tan, W. L.; Chen, Z.; Wong, Chee C.; Wei, J.	Journal Article

Now showing items 1-5 of 5