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Date	Title	Author	Type
2009	Effect of Ni-coated carbon nanotubes on interfacial intermetallic layer growth.	Han, Y. D.; Jing, H. Y.; Nai, S. M. L.; Xu, L. Y.; Tan, Cher Ming.; Wei, Jun.	Conference Paper
2009	Illumination-enhanced hysteresis of transistors based on carbon nanotube networks.	Lee, Chun Wei.; Dong, Xiaochen.; Goh, Seok Hong.; Wang, Junling.; Wei, Jun.; Li, Lain-Jong.	Journal Article
2005	Mathematical model of low-temperature wafer bonding under medium vacuum and its application.	Yu, Wei Bo.; Wei, Jun.; Tan, Cher Ming.; Huang, Guang Yu.	Journal Article
2008	A new creep model for SnAgCu lead-free composite solders : incorporating back stress.	Jing, H. Y.; Nai, S. M. L.; Tan, Cher Ming.; Xu, L. Y.; Zhang, S. R.; Wei, Jun.; Han, Y. D.	Conference Paper

Now showing items 1-4 of 4