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Date	Title	Author	Type
2010	Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads : a TEM study of interfacial evolution.	Xu, H.; Liu, C.; Silberschmidt, V. V.; Chen, Z.; Wei, J.; Sivakumar, M.	Journal Article
2010	A micromechanism study of thermosonic gold wire bonding on aluminium pad.	Xu, H.; Liu, C.; Silberschmidt, V. V.; Pramana, S. S.; White, T. J.; Chen, Z.; Sivakumar, M.; Acoff, V. L.	Journal Article
2009	A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads.	Xu, H.; Liu, C.; Silberschmidt, V. V.; Pramana, S. S.; White, T. J.; Chen, Z.	Journal Article

Now showing items 1-3 of 3