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Date	Title	Author	Type
2004	Barrier property of TiSiN films formed by low frequency, high density inductively coupled plasma process.	Ee, Y. C.; Chen, Z.; Wang, W. D.; Chi, D. Z.; Xu, S.; Law, S. B.	Journal Article
2006	Copper diffusion in Ti–Si–N layers formed by inductively coupled plasma implantation.	Ee, Y. C.; Chen, Z.; Law, S. B.; Xu, S.; Yakovlev, N. L.; Lai, M. Y.	Journal Article
2004	Electroless copper deposition as a seed layer on TiSiN barrier.	Ee, Y. C.; Chen, Z.; Xu, S.; Chan, L.; See, K. H.; Law, S. B.	Journal Article
2009	Formation and characterization of magnetron sputtered Ta–Si–N–O thin ﬁlms.	Yan, H.; Li, L.; Ho, F. Y.; Liang, M. H.; Pan, J. S.; Xu, S.; Chen, Z.	Journal Article
2005	Formation of Ti-Si-N film using low frequency, high density inductively coupled plasma process.	Ee, Y. C.; Chen, Z.; Chan, L.; See, K. H.; Law, S. B.; Xu, S.; Tsakadze, Z. L.; Rutkevych, P. P.; Zeng, K. Y.; Shen, L.	Journal Article
2012	Simultaneous copper ion removal and hydrogen production from water over a TiO2 nanotube photocatalyst.	Xu, S.; Ng, J.; Wang, Y.; Du, A. J.; Sun, Darren Delai.	Journal Article

Now showing items 1-6 of 6