Please use this identifier to cite or link to this item:
https://hdl.handle.net/10356/102276
Title: | Joining copper oxide nanotube arrays driven by the nanoscale Kirkendall effect | Authors: | Chun, Shu Rong Sasangka, Wardhana Aji Ng, Mei Zhen Liu, Qing Du, Anyan Zhu, Jie Ng, Chee Mang Liu, Zhi Qiang Chiam, Sing Yang Gan, Chee Lip |
Keywords: | DRNTU::Engineering::Materials::Nanostructured materials | Issue Date: | 2013 | Source: | Chun, S. R., Sasangka, W. A., Ng, M. Z., Liu, Q., Du, A., Zhu, J., Ng, C. M., et al. (2013). Joining copper oxide nanotube arrays driven by the nanoscale Kirkendall effect. Small, 9(15), 2546-2552. | Series/Report no.: | Small | Abstract: | Various annealing conditions (environment, temperature, and duration) are applied to study the nanoscale Kirkendall effect of copper (Cu) nanowire (NW) arrays on a Si substrate. The results show that an appropriate amount of oxygen supply is crucial for uniform transformation from Cu NWs (average diameter ∼50 nm) into Cu oxide nanotube arrays. An annealing duration of 30 min at 200 °C in a low vacuum environment reveals that the voids are not uniformly distributed at the Cu/Cu oxide interface. This suggests that void growth is due to surface diffusion of Cu along void surfaces. Annealing above 200 °C for 60 min resulted in complete transformation from Cu NWs into Cu oxide nanotubes. X-ray photoelectron spectroscopy characterization indicates that the Cu oxides formed at 200 °C and 300 °C are Cu2O and CuO, respectively. It is demonstrated that the transformation from Cu NW arrays into Cu oxide nanotube arrays can be combined with the joining of stacked Si chips in a single-process step with reasonable joint shear strength. Transmission electron microscopy-electron energy loss spectroscopy elemental mapping analysis reveals that the joint interface is Cu oxide. The outward diffusion of Cu driven by the nanoscale Kirkendall effect is believed to enhance the joining process. By controlling the environment, temperature, and duration, joined Cu2O or CuO nanotube stacked chips can be achieved, which serve as a platform for the further development of nanostructured, stacked devices. | URI: | https://hdl.handle.net/10356/102276 http://hdl.handle.net/10220/19022 |
ISSN: | 1613-6810 | DOI: | 10.1002/smll.201202533 | Schools: | School of Materials Science & Engineering | Research Centres: | Temasek Laboratories | Rights: | © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim. | Fulltext Permission: | none | Fulltext Availability: | No Fulltext |
Appears in Collections: | MSE Journal Articles TL Journal Articles |
SCOPUSTM
Citations
20
23
Updated on Mar 11, 2024
Web of ScienceTM
Citations
10
24
Updated on Oct 26, 2023
Page view(s) 20
734
Updated on Mar 18, 2024
Google ScholarTM
Check
Altmetric
Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.