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Date	Title	Author	Type
2008	Fracture toughness assessment of a solder joint using double cantilever beam specimens.	Lee, Adeline Puay Chen.; Lim, Zan Xuan.; Yantara, Natalia.; Loo, Shane.; Tee, Tong Yan.; Tan, Cher Ming.; Chen, Zhong.	Conference Paper
2008	Humidity effect on the degradation of packaged ultra-bright white LEDs.	Tan, Cher Ming.; Chen, Eric Boon Khai.; Foo, Y. Y.; Chan, R. Y.; Xu, G.; Liu, Y. J.	Conference Paper
2008	The multiple temperature heater platforms for solder Electromigration test conducted at room temperature.	Hou, Yuejin.; Tan, Cher Ming.	Conference Paper
2008	A new creep model for SnAgCu lead-free composite solders : incorporating back stress.	Jing, H. Y.; Nai, S. M. L.; Tan, Cher Ming.; Xu, L. Y.; Zhang, S. R.; Wei, Jun.; Han, Y. D.	Conference Paper

Now showing items 1-4 of 4