Search DR-NTU

Advanced Search Subject Search

Browse

All of DR-NTU
This Community
- Titles
- Authors
- By Date
- Subjects

My Account

Login

Digital Repository - Nanyang Technological University
>
1. Schools
>
College of Engineering
>
Browsing College of Engineering by Author

Browsing College of Engineering by Author "Made, Riko I."

Now showing items 1-7 of 7

Date	Title	Author	Type
2012	Effect of copper TSV annealing on via protrusion for TSV wafer fabrication.	Heryanto, A.; Putra, W. N.; Trigg, A.; Gao, S.; Kwon, W. S.; Che, F. X.; Ang, X. F.; Wei, J.; Made, Riko I.; Gan, Chee Lip.; Pey, Kin Leong.	Journal Article
2009	Experimental characterization and modeling of the contact resistance of Cu-Cu bonded interconnects.	Leong, H. L.; Gan, Chee Lip.; Made, Riko I.; Thompson, Carl V.; Pey, Kin Leong.; Li, H. Y.	Journal Article
2012	Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits.	Made, Riko I.; Gan, Chee Lip.; Yan, Li Ling.; Kor, Katherine Hwee Boon.; Chia, Hong Ling.; Pey, Kin Leong.; Thompson, Carl V.	Journal Article
2010	Modeling of electromigration induced contact resistance reduction of Cu-Cu bonded interface.	Made, Riko I.; Gan, Chee Lip.; Tan, Chuan Seng.	Journal Article
2009	Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications.	Made, Riko I.; Gan, Chee Lip.; Yan, Li Ling.; Yu, Aibin.; Yoon, Seung Wook.; Lau, John H.; Lee, Chengkuo.	Journal Article
2008	Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications.	Made, Riko I.; Gan, Chee Lip.; Yan, Li Ling.; Yu, Aibin.; Yoon, Seung Wook.; Lau, John H.; Lee, Chengkuo.	Journal Article
2011	Study of the evolution of Cu-Cu bonding interface imperfection under direct current stressing for three dimensional integrated circuits.	Made, Riko I.; Lan, Peng.; Li, Hong Yu.; Gan, Chee Lip.; Tan, Chuan Seng.	Conference Paper

Now showing items 1-7 of 7