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Browsing School of Electrical and Electronic Engineering (EEE) by Subject "DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging."

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Browsing School of Electrical and Electronic Engineering (EEE) by Subject "DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging."

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Date Title Author Type
2008
Impacts of bends and ground return vias on interconnects for high speed GHz designs.
Chang, Richard Weng Yew.; See, Kye Yak.; Tan, Yang Long.
Conference Paper