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Browsing School of Electrical and Electronic Engineering (EEE) by Author "Tan, Cher Ming."

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Browsing School of Electrical and Electronic Engineering (EEE) by Author "Tan, Cher Ming."

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Date Title Author Type
2009
3D circuit model for 3D IC reliability study.
Tan, Cher Ming.; He, Feifei.
Conference Paper
2002
Application of Wigner–Ville distribution in electromigration noise analysis.
Tan, Cher Ming.; Lim, Shin Yeh.
Journal Article
2012
Applications of multi-walled carbon nanotube in electronic packaging.
Tan, Cher Ming.; Baudot, Charles.; Han, Yongdian.; Jing, Hongyang.
Journal Article
2009
Comparative study of non-standard power diodes.
Tan, Cher Ming.; Raghavan, Nagarajan.; Sun, Lina.; Hsu, Chuck.; Wang, Chase.
Conference Paper
2005
Current crowding effect on copper dual damascene via bottom failure for ULSI applications.
Tan, Cher Ming.; Arijit, Roy.; Vairagar, A. V.; Krishnamoorthy, Ahila.; Mhaisalkar, Subodh G.
Journal Article
2004
Dynamic study of the physical processes in the intrinsic line electromigration of deep-submicron copper and aluminum interconnects.
Tan, Cher Ming.; Zhang, Guan.; Gan, Zhenghao.
Journal Article
1999
Effect of BOE etching time on wire bonding quality.
Tan, Cher Ming.; Linggajaya, Kaufik.; Er, Eddie.; Chai, Vincent Siew Heong.
Journal Article
2009
Effect of Ni-coated carbon nanotubes on interfacial intermetallic layer growth.
Han, Y. D.; Jing, H. Y.; Nai, S. M. L.; Xu, L. Y.; Tan, Cher Ming.; Wei, Jun.
Conference Paper
1998
Failure analysis of bond pad metal peeling using FIB and AFM.
Tan, Cher Ming.; Er, Eddie.; Hua, Younan.; Chai, Vincent Siew Heong.
Journal Article
2003
Failure mechanisms of aluminum bondpad peeling during thermosonic bonding.
Tan, Cher Ming.; Gan, Zhenghao.
Journal Article
2008
Fracture toughness assessment of a solder joint using double cantilever beam specimens.
Lee, Adeline Puay Chen.; Lim, Zan Xuan.; Yantara, Natalia.; Loo, Shane.; Tee, Tong Yan.; Tan, Cher Ming.; Chen, Zhong.
Conference Paper
2009
Going green for discrete power diode manufacturers.
Tan, Cher Ming.; Sun, Lina.; Wang, Chase.
Conference Paper
2008
Humidity effect on the degradation of packaged ultra-bright white LEDs.
Tan, Cher Ming.; Chen, Eric Boon Khai.; Foo, Y. Y.; Chan, R. Y.; Xu, G.; Liu, Y. J.
Conference Paper
2010
Imperfect predictive maintenance model for multi-state systems with multiple failure modes and element failure dependency.
Tan, Cher Ming.; Raghavan, Nagarajan.
Conference Paper
2005
Mathematical model of low-temperature wafer bonding under medium vacuum and its application.
Yu, Wei Bo.; Wei, Jun.; Tan, Cher Ming.; Huang, Guang Yu.
Journal Article
2008
The multiple temperature heater platforms for solder Electromigration test conducted at room temperature.
Hou, Yuejin.; Tan, Cher Ming.
Conference Paper
2008
A new creep model for SnAgCu lead-free composite solders : incorporating back stress.
Jing, H. Y.; Nai, S. M. L.; Tan, Cher Ming.; Xu, L. Y.; Zhang, S. R.; Wei, Jun.; Han, Y. D.
Conference Paper
2003
Nondestructive void size determination in copper metallization under passivation.
Gan, Zhenghao.; Tan, Cher Ming.; Zhang, Guan.
Journal Article
2009
Requirement for accurate interconnect temperature measurement for electromigration test.
Hou, Yuejin.; Tan, Cher Ming.
Conference Paper
2008
Statistical modeling of via redundancy effects on interconnect reliability.
Raghavan, Nagarajan.; Tan, Cher Ming.
Conference Paper