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Browsing School of Materials Science and Engineering (MSE) by Title

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Date Title Author Type
2011
Effective control of polarity in Bi0.9La0.1FeO3 thin films by dopant-related internal bias.
Wang, Yang.; Chen, Weigang.; Chen, Zuhuang.; Rami, Naidu Chukka.; Wang, Junling.; Wang, John.; Chen, Lang.
Journal Article
2009
Effective doping of single-layer graphene from underlying SiO2 substrates.
Shi, Yumeng.; Dong, Xiaochen.; Chen, Peng.; Wang, Junling.; Li, Lain-Jong.
Journal Article
2011
Effect of Ag-doping on crystal structure and high temperature thermoelectric properties of c-axis oriented Ca3Co4O9 thin films by pulsed laser deposition.
Sun, T.; Hng, Huey Hoon.; Yan, Qingyu.; Ma, Jan.
Journal Article
2009
The effect of AlOOH boehmite nanorods on mechanical property of hybrid composite coatings.
Chen, Q.; Udomsangpetch, C.; Shen, S. C.; Liu, Y. C.; Chen, Z.; Zeng, X. T.
Journal Article
2006
The effect of aspect ratio scaling on hydrostatic stress in passivated interconnects.
Ang, Derrick.; Wong, Chee C.; Ramanujan, R. V.
Journal Article
2010
Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads : a TEM study of interfacial evolution.
Xu, H.; Liu, C.; Silberschmidt, V. V.; Chen, Z.; Wei, J.; Sivakumar, M.
Journal Article
2008
Effect of chain length on low temperature gold-gold bonding by self assembled monolayers.
Ang, X. F.; Chen, Z.; Wong, Chee C.; Wei, J.
Journal Article
2012
Effect of copper TSV annealing on via protrusion for TSV wafer fabrication.
Heryanto, A.; Putra, W. N.; Trigg, A.; Gao, S.; Kwon, W. S.; Che, F. X.; Ang, X. F.; Wei, J.; Made, Riko I.; Gan, Chee Lip.; Pey, Kin Leong.
Journal Article
2004
Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder.
Kumar, A.; He, Min.; Chen, Zhong.; Teo, P. S.
Journal Article
2006
Effect of electron beam treatment on adhesion of Ta/polymeric low-k interface.
Gan, Zhenghao.; Chen, Zhong.; Mhaisalkar, S. G.; Damayanti, M.; Chen, Zhe.; Prasad, K.; Zhang, Sam.; Jiang, Ning.
Journal Article
2011
Effect of intermolecular dipole−dipole interactions on interfacial supramolecular structures of C3-symmetric hexa-peri-hexabenzocoronene derivatives.
Mu, Zhongcheng.; Shao, Qi.; Ye, Jun.; Zeng, Zebing.; Zhao, Yang.; Hng, Huey Hoon.; Boey, Freddy Yin Chiang.; Wu, Jishan.; Chen, Xiaodong.
Journal Article
2002
Effect of ion implantation on layer inversion of Ni silicided poly-Si.
Lee, Pooi See.; Pey, Kin Leong.; Mangelinck, D.; Ding, J.; Chi, Dong Zhi.; Osipowicz, T.; Dai, J. Y.; Chan, L.
Journal Article
2004
Effect of linewidth scaling on hydrostatic stress in passivated interconnects.
Ang, Derrick.; Ramanujan, R. V.
Conference Paper
2007
Effect of low fluence laser annealing on ultrathin Lu2O3 high-k dielectric.
Darmawan, P.; Lee, Pooi See.; Setiawan, Y.; Ma, Jan.; Osipowicz, T.
Journal Article
2005
Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate.
Kumar, Aditya.; Chen, Zhong.; Mhaisalkar, Subodh Gautam.; Wong, Chee Cheong.; Teo, Poi Siong.; Kripesh, Vaidhyanathan.
Journal Article
2003
Effect of plating parameters on the intrinsic stress in electroless nickel plating.
Chen, Zhong.; Xu, Xiaoda.; Wong, Chee C.; Mhaisalkar, S. G.
Journal Article
2004
Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization.
He, Min.; Chen, Zhong.; Qi, Guojun.; Wong, Chee C.; Mhaisalkar, S. G.
Journal Article
2004
Effect of processing parameters on electroless Cu seed layer properties.
Ee, Y. C.; Chen, Z.; Chan, L.; See, Alex K. H.; Law, S. B.; Tee, K. C.; Zeng, K. Y.; Shen, L.
Journal Article
2011
Effect of transition metal (M = Co, Ni, Cu) substitution on electronic structure and vacancy formation of Li3N.
Wu, Shunnian.; Dong, Zhili.; Wu, Ping.; Boey, Freddy Yin Chiang.
Journal Article
2005
The effects of space charge, dopants, and strain fields on surfaces and grain boundaries in YBCO compounds.
Su, Haibin.; Welch, David O.
Journal Article