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Browsing EEE Conference Papers by Author "IEEE International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (10th:2009:Delft, The Netherlands)"

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Browsing EEE Conference Papers by Author "IEEE International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (10th:2009:Delft, The Netherlands)"

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Date Title Author Type
2009
3D circuit model for 3D IC reliability study.
Tan, Cher Ming.; He, Feifei.
Conference Paper