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Digital Repository - Nanyang Technological University
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1. Schools
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College of Engineering
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School of Electrical and Electronic Engineering (EEE)
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EEE Conference Papers
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Browsing EEE Conference Papers by Author

Browsing EEE Conference Papers by Author "IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (15th:2008:Singapore)"

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Date	Title	Author	Type
2008	Statistical modeling of via redundancy effects on interconnect reliability.	Raghavan, Nagarajan.; Tan, Cher Ming.	Conference Paper

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