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Date Title Author Type
2009
Antenna-on-chip and antenna-in-package solutions to highly-integrated millimeter-wave devices for wireless communications.
Zhang, Yue Ping.; Liu, Duixian.
Journal Article
2012
Application of the grain flipping probability model to heat assisted magnetic recording.
Sari Shafidah Shafiee.; Elidrissi, Moulay Rachid.; Wang, Hong Tao.; Eason, Kwaku.; Radhakrishnan, Rathna Kumar.; Chan, Kheong Sann.; Guan, Yong Liang.
Journal Article
2002
Application of Wigner–Ville distribution in electromigration noise analysis.
Tan, Cher Ming.; Lim, Shin Yeh.
Journal Article
2012
Applications of multi-walled carbon nanotube in electronic packaging.
Tan, Cher Ming.; Baudot, Charles.; Han, Yongdian.; Jing, Hongyang.
Journal Article
2007
Arbitrated time-to-first spike CMOS image sensor with on-chip histogram equalization.
Chen, Shoushun.; Amine, Bermak.
Journal Article
2006
Argon plasma exposure enhanced intermixing in an undoped InGaAsP/InP quantum-well structure.
Mei, Ting.; Tang, Xiao Hong.; Wang, Yixin.; Djie, Hery Susanto.; Chin, M. K.; Nie, Dong.
Journal Article
2008
Asynchronous control network optimization using fast minimum cycle time analysis.
Law, Chong Fatt.; Gwee, Bah Hwee.; Chang, Joseph S.
Journal Article
2011
Audio projection : directional sound and its applications in immersive communication.
Gan, Woon Seng.; Tan, Ee Leng.; Kuo, Sen M.
Journal Article
2013
Bandwidth analysis of waveguide grating coupler.
Xiao, Zhe.; Liow, Tsung-Yang.; Zhang, Jing.; Shum, Ping.; Luan, Feng.
Journal Article
2006
Beyond rubber prices : negotiating the Great Depression in Singapore.
Loh, Kah Seng.
Journal Article
2007
Bimetallic silver-gold film waveguide surface plasmon resonance sensor.
Ong, Biow Hiem.; Yuan, Xiaocong.; Tjin, Swee Chuan.
Journal Article
2007
Biosensor based on two-dimensional photonic lattice.
Irawan, Rudi.; Zhang, Dianwen.; Tjin, Swee Chuan.; Yuan, Xiaocong.
Journal Article
2009
Bit-error-rate analysis of UWB radio using BPSK modulation over inter-chip radio channels for wireless chip area networks.
Chen, Zhi Ming.; Zhang, Yue Ping.; Hu, Ai Qun.; Ng, Tung Sang.
Journal Article
2004
Bit-error-rate performance of intra-chip wireless interconnect systems.
Zhang, Yue Ping.
Journal Article
2012
Bonding and diffusion of nitrogen in the InSbN alloys fabricated by two-step ion implantation.
Wang, Youyi.; Zhang, Dao Hua.; Chen, X. Z.; Jin, Y. J.; Li, J. H.; Liu, C. J.; Wee, A. T. S.; Zhang, Sam.; Ramam, A.
Journal Article
2007
Broad-band design techniques for transimpedance amplifiers.
Lu, Zhenghao.; Yeo, Kiat Seng.; Ma, Jianguo.; Do, Manh Anh.; Lim, Wei Meng.; Chen, Xueying.
Journal Article
2006
Broad-band EDFA gain flattening by using an embedded long-period fiber grating filter.
Ni, N.; Chan, Chi Chiu.; Tan, Khay Ming.; Tjin, Swee Chuan.; Dong, X. Y.
Journal Article
2007
Built-in electric field enhancement/retardation on intermixing.
Xu, C. D.; Chin, M. K.; Mei, Ting.; Dong, Jian Rong.; Chua, Soo Jin.
Journal Article
2008
A capacitive-based accelerometer IC using injection-nulling switch technique.
Lee, W. F.; Chan, Pak Kwong.
Journal Article
2012
Carbon nanotube bumps for the flip chip packaging system.
Yap, Chin Chong.; Brun, Christophe.; Tan, Dunlin.; Li, Hong.; Teo, Edwin Hang Tong.; Baillargeat, Dominique.; Tay, Beng Kang.
Journal Article