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Browsing EEE Journal Articles by Author "Gan, Chee Lip."

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Browsing EEE Journal Articles by Author "Gan, Chee Lip."

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Date Title Author Type
2012
Effect of copper TSV annealing on via protrusion for TSV wafer fabrication.
Heryanto, A.; Putra, W. N.; Trigg, A.; Gao, S.; Kwon, W. S.; Che, F. X.; Ang, X. F.; Wei, J.; Made, Riko I.; Gan, Chee Lip.; Pey, Kin Leong.
Journal Article
2013
Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits.
Made, Riko I.; Peng, Lan.; Li, Hong Yu.; Gan, Chee Lip.; Tan, Chuan Seng.
Journal Article
2012
Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits.
Made, Riko I.; Gan, Chee Lip.; Yan, Li Ling.; Kor, Katherine Hwee Boon.; Chia, Hong Ling.; Pey, Kin Leong.; Thompson, Carl V.
Journal Article
2010
Modeling of electromigration induced contact resistance reduction of Cu-Cu bonded interface.
Made, Riko I.; Gan, Chee Lip.; Tan, Chuan Seng.
Journal Article
2012
Self-organization of a hybrid nanostructure consisting of a nanoneedle and nanodot.
Liu, Hai.; Wu, Junsheng.; Wang, Ying.; Chow, Chee Lap.; Liu, Qing.; Gan, Chee Lip.; Tang, Xiaohong.; Rawat, Rajdeep Singh.; Tan, Ooi Kiang.; Ma, Jan.; Huang, Yizhong.
Journal Article