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Browsing EEE Journal Articles by Author "Tan, Cher Ming."

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Browsing EEE Journal Articles by Author "Tan, Cher Ming."

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Date Title Author Type
2002
Application of Wigner–Ville distribution in electromigration noise analysis.
Tan, Cher Ming.; Lim, Shin Yeh.
Journal Article
2012
Applications of multi-walled carbon nanotube in electronic packaging.
Tan, Cher Ming.; Baudot, Charles.; Han, Yongdian.; Jing, Hongyang.
Journal Article
2005
Current crowding effect on copper dual damascene via bottom failure for ULSI applications.
Tan, Cher Ming.; Arijit, Roy.; Vairagar, A. V.; Krishnamoorthy, Ahila.; Mhaisalkar, Subodh G.
Journal Article
2004
Dynamic study of the physical processes in the intrinsic line electromigration of deep-submicron copper and aluminum interconnects.
Tan, Cher Ming.; Zhang, Guan.; Gan, Zhenghao.
Journal Article
1999
Effect of BOE etching time on wire bonding quality.
Tan, Cher Ming.; Linggajaya, Kaufik.; Er, Eddie.; Chai, Vincent Siew Heong.
Journal Article
1998
Failure analysis of bond pad metal peeling using FIB and AFM.
Tan, Cher Ming.; Er, Eddie.; Hua, Younan.; Chai, Vincent Siew Heong.
Journal Article
2003
Failure mechanisms of aluminum bondpad peeling during thermosonic bonding.
Tan, Cher Ming.; Gan, Zhenghao.
Journal Article
2005
Mathematical model of low-temperature wafer bonding under medium vacuum and its application.
Yu, Wei Bo.; Wei, Jun.; Tan, Cher Ming.; Huang, Guang Yu.
Journal Article
2003
Nondestructive void size determination in copper metallization under passivation.
Gan, Zhenghao.; Tan, Cher Ming.; Zhang, Guan.
Journal Article
2003
Temperature and stress distribution in the SOI structure during fabrication.
Tan, Cher Ming.; Gan, Zhenghao.; Gao, Xiaofang.
Journal Article
1999
Using power diode models for circuit simulations : a comprehensive review.
Tan, Cher Ming.; Tseng, King Jet.
Journal Article