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Date Title Author Type
2009
The effect of AlOOH boehmite nanorods on mechanical property of hybrid composite coatings.
Chen, Q.; Udomsangpetch, C.; Shen, S. C.; Liu, Y. C.; Chen, Z.; Zeng, X. T.
Journal Article
2006
The effect of aspect ratio scaling on hydrostatic stress in passivated interconnects.
Ang, Derrick.; Wong, Chee C.; Ramanujan, R. V.
Journal Article
2010
Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads : a TEM study of interfacial evolution.
Xu, H.; Liu, C.; Silberschmidt, V. V.; Chen, Z.; Wei, J.; Sivakumar, M.
Journal Article
2008
Effect of chain length on low temperature gold-gold bonding by self assembled monolayers.
Ang, X. F.; Chen, Z.; Wong, Chee C.; Wei, J.
Journal Article
2012
Effect of copper TSV annealing on via protrusion for TSV wafer fabrication.
Heryanto, A.; Putra, W. N.; Trigg, A.; Gao, S.; Kwon, W. S.; Che, F. X.; Ang, X. F.; Wei, J.; Made, Riko I.; Gan, Chee Lip.; Pey, Kin Leong.
Journal Article
2004
Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder.
Kumar, A.; He, Min.; Chen, Zhong.; Teo, P. S.
Journal Article
2006
Effect of electron beam treatment on adhesion of Ta/polymeric low-k interface.
Gan, Zhenghao.; Chen, Zhong.; Mhaisalkar, S. G.; Damayanti, M.; Chen, Zhe.; Prasad, K.; Zhang, Sam.; Jiang, Ning.
Journal Article
2011
Effect of intermolecular dipole−dipole interactions on interfacial supramolecular structures of C3-symmetric hexa-peri-hexabenzocoronene derivatives.
Mu, Zhongcheng.; Shao, Qi.; Ye, Jun.; Zeng, Zebing.; Zhao, Yang.; Hng, Huey Hoon.; Boey, Freddy Yin Chiang.; Wu, Jishan.; Chen, Xiaodong.
Journal Article
2002
Effect of ion implantation on layer inversion of Ni silicided poly-Si.
Lee, Pooi See.; Pey, Kin Leong.; Mangelinck, D.; Ding, J.; Chi, Dong Zhi.; Osipowicz, T.; Dai, J. Y.; Chan, L.
Journal Article
2007
Effect of low fluence laser annealing on ultrathin Lu2O3 high-k dielectric.
Darmawan, P.; Lee, Pooi See.; Setiawan, Y.; Ma, Jan.; Osipowicz, T.
Journal Article
2005
Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate.
Kumar, Aditya.; Chen, Zhong.; Mhaisalkar, Subodh Gautam.; Wong, Chee Cheong.; Teo, Poi Siong.; Kripesh, Vaidhyanathan.
Journal Article
2003
Effect of plating parameters on the intrinsic stress in electroless nickel plating.
Chen, Zhong.; Xu, Xiaoda.; Wong, Chee C.; Mhaisalkar, S. G.
Journal Article
2004
Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization.
He, Min.; Chen, Zhong.; Qi, Guojun.; Wong, Chee C.; Mhaisalkar, S. G.
Journal Article
2004
Effect of processing parameters on electroless Cu seed layer properties.
Ee, Y. C.; Chen, Z.; Chan, L.; See, Alex K. H.; Law, S. B.; Tee, K. C.; Zeng, K. Y.; Shen, L.
Journal Article
2011
Effect of transition metal (M = Co, Ni, Cu) substitution on electronic structure and vacancy formation of Li3N.
Wu, Shunnian.; Dong, Zhili.; Wu, Ping.; Boey, Freddy Yin Chiang.
Journal Article
2005
The effects of space charge, dopants, and strain fields on surfaces and grain boundaries in YBCO compounds.
Su, Haibin.; Welch, David O.
Journal Article
2006
Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films.
Chen, Zhong.; He, Min.; Balakrisnan, Bavani.; Chum, Chan Choy.
Journal Article
2007
Electret mechanism, hysteresis, and ambient performance of sol-gel silica gate dielectrics in pentacene field-effect transistors.
Cahyadi, T.; Tan, H. S.; Mhaisalkar, S. G.; Lee, Pooi See.; Boey, Freddy Yin Chiang.; Chen, Z. K.; Ng, C. M.; Rao, V. R.; Qi, G. J.
Journal Article
2012
Electrical and photoresponse properties of Co3O4 nanowires.
Varghese, Binni.; Mukherjee, Bablu.; Karthik, K. R. G.; Jinesh, K. B.; Mhaisalkar, Subodh Gautam.; Tok, Eng Soon.; Sow, Chorng Haur.
Journal Article
2006
Electrical detection of hybridization and threading intercalation of deoxyribonucleic acid using carbon nanotube network field-effect transistors.
Gui, Ee Ling.; Li, Lain-Jong.; Lee, Pooi See.; Lohani, Anup.; Mhaisalkar, S. G.; Cao, Qing.; Kang, Seong Jun.; Rogers, John A.; Tansil, N. C.; Gao, Zhiqiang.
Journal Article