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Date	Title	Author	Type
2004	Barrier properties of thin Au/Ni–P under bump metallization for Sn–3.5Ag solder.	Kumar, Aditya.; He, Min.; Chen, Zhong.	Journal Article
2004	Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder.	Kumar, A.; He, Min.; Chen, Zhong.; Teo, P. S.	Journal Article
2004	Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization.	He, Min.; Chen, Zhong.; Qi, Guojun.; Wong, Chee C.; Mhaisalkar, S. G.	Journal Article
2006	Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films.	Chen, Zhong.; He, Min.; Balakrisnan, Bavani.; Chum, Chan Choy.	Journal Article
2004	Interfacial reaction between Sn-rich solders and Ni-based metallization.	He, Min.; Kumar, A.; Yeo, P. T.; Qi, Guojun.; Chen, Zhong.	Journal Article
2004	Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reaction.	He, Min.; Lau, Wee Hua.; Qi, Guojun.; Chen, Zhong.	Journal Article
2005	Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints.	He, Min.; Chen, Zhong.; Qi, Guojun.	Journal Article
2004	Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization.	He, Min.; Chen, Zhong.; Qi, Guojun.	Journal Article

Now showing items 1-8 of 8