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Nondestructive void size determination in copper metallization under passivation

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Nondestructive void size determination in copper metallization under passivation

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dc.contributor.author Gan, Zhenghao
dc.contributor.author Tan, Cher Ming
dc.contributor.author Zhang, Guan
dc.date.accessioned 2009-07-28T03:51:25Z
dc.date.available 2009-07-28T03:51:25Z
dc.date.copyright 2003
dc.date.issued 2009-07-28T03:51:25Z
dc.identifier.citation Gan, Z., Tan, C. M., & Zhang, G. (2003). Nondestructive void size determination in copper metallization under passivation. IEEE Transactions on Device and Materials Reliability, (3)3, 69-78.
dc.identifier.issn 1530-4388
dc.identifier.uri http://hdl.handle.net/10220/4709
dc.description.abstract A novel nondestructive failure analysis technique to rapidly locate tiny voids in narrow metallization line covered with passivation is proposed, based on the simulation results. In this technique, the current alteration in a metal line under study is recorded continuously when it is subjected to electron beam shining and biased by a small external voltage. Finite-element analysis is performed to simulate the temperature distribution and current alteration in the metal line. The electron-beam heating is demonstrated as the most important factor contributing to the current alteration. Reconstruction of voids with any shape(such as wedge or slit) is possible on the basis of the gradient of the current alteration. It is found that the minimum detectable void size can be as low as 50 nm. Experimental verification of the technique is underway.
dc.format.extent 10 p.
dc.language.iso en
dc.relation.ispartofseries IEEE transactions on device and materials reliability
dc.rights © 2003 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
dc.subject DRNTU::Engineering::Electrical and electronic engineering.
dc.title Nondestructive void size determination in copper metallization under passivation
dc.type Journal Article
dc.contributor.school School of Electrical and Electronic Engineering
dc.identifier.doi http://dx.doi.org/10.1109/TDMR.2003.815285
dc.description.version Published version

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