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Mathematical model of low-temperature wafer bonding under medium vacuum and its application

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Mathematical model of low-temperature wafer bonding under medium vacuum and its application

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Title: Mathematical model of low-temperature wafer bonding under medium vacuum and its application
Author: Yu, Weibo; Wei, Jun; Tan, Cher Ming; Huang, Guang Yu
Copyright year: 2005
Abstract: Low-temperature direct wafer bonding was successfully performed under medium vacuum level. A mathematical model was developed based on the qualitative understanding of the bonding mechanisms. The model combined the diffusion-reaction model of water in SiO2 and the diffusion theory in porous media. It is found that the model agrees well with the experimental data. This model can be applied to predict the effects of annealing time, annealing temperature, ambient vacuum, wafer orientation, and wafer dimension on the bond strength.
Subject: DRNTU::Engineering::Electrical and electronic engineering.
Type: Journal Article
Series/ Journal Title: IEEE transactions on advanced packaging
School: School of Electrical and Electronic Engineering
Rights: © 2005 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
Version: Published version

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