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Mathematical model of low-temperature wafer bonding under medium vacuum and its application

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Mathematical model of low-temperature wafer bonding under medium vacuum and its application

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dc.contributor.author Yu, Weibo
dc.contributor.author Wei, Jun
dc.contributor.author Tan, Cher Ming
dc.contributor.author Huang, Guang Yu
dc.date.accessioned 2009-07-28T08:03:49Z
dc.date.available 2009-07-28T08:03:49Z
dc.date.copyright 2005
dc.date.issued 2009-07-28T08:03:49Z
dc.identifier.citation Yu, W., Wei, J., Tan, C. M., & Huang, G. Y. (2005). Mathematical model of low-temperature wafer bonding under medium vacuum and its application. IEEE Transactions on Advanced Packaging. 28(4), 650-658.
dc.identifier.issn 1521-3323
dc.identifier.uri http://hdl.handle.net/10220/5336
dc.description.abstract Low-temperature direct wafer bonding was successfully performed under medium vacuum level. A mathematical model was developed based on the qualitative understanding of the bonding mechanisms. The model combined the diffusion-reaction model of water in SiO2 and the diffusion theory in porous media. It is found that the model agrees well with the experimental data. This model can be applied to predict the effects of annealing time, annealing temperature, ambient vacuum, wafer orientation, and wafer dimension on the bond strength.
dc.format.extent 9 p.
dc.language.iso en
dc.relation.ispartofseries IEEE transactions on advanced packaging
dc.rights © 2005 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
dc.subject DRNTU::Engineering::Electrical and electronic engineering.
dc.title Mathematical model of low-temperature wafer bonding under medium vacuum and its application
dc.type Journal Article
dc.contributor.school School of Electrical and Electronic Engineering
dc.identifier.doi http://dx.doi.org/10.1109/TADVP.2005.858306
dc.description.version Published version

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