Integrated circuit ceramic ball grid array package antenna

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Integrated circuit ceramic ball grid array package antenna

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dc.contributor.author Zhang, Yue Ping
dc.date.accessioned 2009-08-03T02:52:53Z
dc.date.available 2009-08-03T02:52:53Z
dc.date.copyright 2004
dc.date.issued 2009-08-03T02:52:53Z
dc.identifier.citation Zhang, Y. P. (2004). Integrated circuit ceramic ball grid array package antenna. IEEE Transactions On Antennas And Propagation. 52(10), 2538-2544.
dc.identifier.issn 0018-926X
dc.identifier.uri http://hdl.handle.net/10220/5996
dc.description.abstract The recent advances in such highly integrated RF transceivers as radio system-on-chip and radio system-in-package have called for the parallel development of compact and efficient antennas. This paper addresses the development of a new type of dielectric chip antenna known as integrated circuit package antenna (ICPA) for highly integrated RF transceivers. A compact ICPA of this type has, for the first time, been designed and fabricated in a ceramic ball grid array (CBGA) package format. The novel ICPA, except economical advantage of mass production and automatic assembly, has potential benefit to the system-level board miniaturization and the system-level manufacturing facilitation. The simulated and measured antenna performance of the ICPA is presented. The effects of the different physical parts of the ICPA on the antenna performance are investigated. Results show that the ICPA achieved impedance bandwidth of 4.1% and radiation efficiency of 72%, and gain of 4.8 dBi at 5.715 GHz.
dc.format.extent 7 p.
dc.language.iso en
dc.relation.ispartofseries IEEE transactions on antennas and propagation
dc.rights IEEE Transactions On Antennas And Propagation © 2004 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site.
dc.subject DRNTU::Engineering::Electrical and electronic engineering.
dc.title Integrated circuit ceramic ball grid array package antenna
dc.type Journal Article
dc.contributor.school School of Electrical and Electronic Engineering
dc.identifier.doi http://dx.doi.org/10.1109/TAP.2004.834427
dc.description.version Published version

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