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Title:
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Antenna-on-chip and antenna-in-package solutions to highly-integrated millimeter-wave devices for wireless communications.
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Author:
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Zhang, Yue Ping.; Liu, Duixian.
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Copyright year:
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2009 |
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Abstract:
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Antenna-on-chip (AoC) and antenna-in-package
(AiP) solutions are studied for highly integrated millimeter-wave
(mmWave) devices in wireless communications. First, the background,
regulations, standard, and applications of 60-GHz wireless
communications are briefly introduced. Then, highly integrated
60-GHz radios are overviewed as a basis for the link budget
analysis to derive the antenna gain requirement. Next, in order
to have deep physical insight into the AoC solution, the silicon
substrate’s high permittivity and low resistivity effects on the AoC
efficiency are examined. It is shown that the AoC solution has low
efficiency, less than 12% due to large ohmic losses and surface
waves, which requires the development of techniques to improve
the AoC efficiency. After that, the AiP solution and associated
challenges such as how to realize low-loss interconnection between
the chip and antenna are addressed. It is shown that wire-bonding
interconnects, although inferior to the flip-chip, are still feasible in
the 60-GHz band if proper compensation schemes are utilized. An
example of the AiP solution in a low-temperature cofired ceramic
(LTCC) process is presented in the 60-GHz band showing an
efficiency better than 90%. A major concern with both AoC and
AiP solutions is electromagnetic interference (EMI), which is also
discussed. Finally, the systems level pros and cons of both AoC and
AiP solutions are highlighted from the electrical and economic
perspectives for system designers. |
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Subject:
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DRNTU::Engineering::Electrical and electronic engineering. |
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Type:
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Journal Article |
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Series/ Journal Title:
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IEEE transactions on antennas and propagation |
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School:
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School of Electrical and Electronic Engineering |
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Rights:
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© 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. |
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Version:
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Published version |
