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A new unified model for channel thermal noise of deep sub-micron RFCMOS

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A new unified model for channel thermal noise of deep sub-micron RFCMOS

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Title: A new unified model for channel thermal noise of deep sub-micron RFCMOS
Author: Ong, Shih Ni; Yeo, Kiat Seng; Chan, Lye Hock; Loo, Xi Sung; Boon, Chirn Chye; Do, Manh Anh; Chew, Kok Wai Johnny
Copyright year: 2009
Abstract: A new unified model for circuit simulation is presented to predict the high frequency channel thermal noise of deep sub-micron MOSFETs in strong inversion region. Based on the new channel thermal noise model, the simulated channel thermal noise spectral densities of the devices fabricated in a 0.13μm RFCMOS technology process are compared to the channel noise directly extracted from RF noise measurements.
Subject: DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits.
Type: Conference Paper
Conference name: IEEE International Symposium on Radio-Frequency Integration Technology (2009 : Singapore)
School: School of Electrical and Electronic Engineering
Related Organization: Chartered Semiconductor Manufacturing Ltd
Rights: © 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
Version: Published version

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