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The multiple temperature heater platforms for solder Electromigration test conducted at room temperature

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The multiple temperature heater platforms for solder Electromigration test conducted at room temperature

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Title: The multiple temperature heater platforms for solder Electromigration test conducted at room temperature
Author: Hou, Yuejin; Tan, Cher Ming
Copyright year: 2008
Abstract: To accommodate the increasing input-out (I/O) counts in future integrated circuits, the size of the solder bumps has to shrink and current density through each solder bump increasing. With the ever-increasing current density through the solder bumps, electromigration (EM) remains as a main concern for the reliability of future solder bumps. This phenomenon is responsible for the structural damage of solder bumps in the form of void formation caused by ionic diffusion driven by high electron wind force. Conventional solder bump EM test is performed in high temperature oven with high stress current. Besides the high cost oven, the total test time can be very long as the EM test has to be performed at several different temperatures and EM failure for solder bumps is usually much longer than their interconnect counterpart. In this work, we propose a multiple temperature heater platform for solder EM test conducted at room temperature. This platform eliminates the use of high cost oven. In addition, the solder joints can be tested at different temperatures simultaneously, shorting the total required EM test time. This proposal is verified by ANSYS@ finite element simulations through the corresponding electrical-thermal analysis.
Subject: DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials.
Type: Conference Paper
Conference name: Electronics Packaging Technology Conference (10th : 2008 : Singapore)
School: School of Electrical and Electronic Engineering
Rights: © 2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
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