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Fracture toughness assessment of a solder joint using double cantilever beam specimens

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Fracture toughness assessment of a solder joint using double cantilever beam specimens

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dc.contributor.author Lee, Adeline Puay Chen
dc.contributor.author Lim, Zan Xuan
dc.contributor.author Yantara, Natalia
dc.contributor.author Loo, Shane Zhi Yuan
dc.contributor.author Tee, Tong Yan
dc.contributor.author Tan, Cher Ming
dc.contributor.author Chen, Zhong
dc.date.accessioned 2010-08-31T07:07:04Z
dc.date.available 2010-08-31T07:07:04Z
dc.date.copyright 2008
dc.date.issued 2010-08-31T07:07:04Z
dc.identifier.citation Lee, A. P. C., Lim, Z. X., Yantara, N., Loo, S. Z. Y., Tee, T. Y., Tan, C. M., et al. (2008). Fracture toughness assessment of a solder joint using double cantilever beam specimens. In proceedings of the 10th Electronics Packaging Technology Conference: Singapore, (pp.1066-1073).
dc.identifier.uri http://hdl.handle.net/10220/6384
dc.description.abstract Conventional assessment of solder joint reliability uses either ball shear test or solder ball pull test. The test results are reported in terms of materials strength in either shear or tensile mode, and the strength values are size-dependent. Therefore these test results are largely useful only for qualitative comparison and qualification of the products. In the current effort, we aim at developing an assessment scheme for solder joint interface fracture toughness. The obtained results, in terms of critical energy release rate, predict the joint failure based on the principle of fracture mechanics. The results can be used as a materials property in the reliability design of various types of solder-ball joined packages. Double cantilever beam (DCB) specimens made of 99.9 wt% copper were selected in the current work. Eutectic Sn-37Pb solder was used to join two pieces of the copper plates with controlled solder thickness. The test record showed steady propagation of the crack along the solder/copper interface, which verifies the viability of such a testing scheme. Interface fracture toughness for as-joined, extensively-reflowed and thermally aged samples has been measured. Both the reflow treatment and the thermal aging lead to degradation of solder joint fracture resistance. To understand the degradation, fractographic analysis by scanning electron microscopy (SEM) has been carried out from both top and cross-sectional views of the fractured surfaces.
dc.format.extent 8 p.
dc.language.iso en
dc.rights © 2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
dc.subject DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials.
dc.subject DRNTU::Engineering::Materials.
dc.title Fracture toughness assessment of a solder joint using double cantilever beam specimens
dc.type Conference Paper
dc.contributor.conference Electronics Packaging Technology Conference (10th : 2008 : Singapore)
dc.contributor.school School of Electrical and Electronic Engineering
dc.identifier.doi http://dx.doi.org/10.1109/EPTC.2008.4763571
dc.description.version Published version
dc.contributor.organization Amkor Technology Singapore Pte Ltd

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