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Impacts of bends and ground return vias on interconnects for high speed GHz designs

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Impacts of bends and ground return vias on interconnects for high speed GHz designs

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Title: Impacts of bends and ground return vias on interconnects for high speed GHz designs
Author: Chang, Richard Weng Yew; See, Kye Yak; Tan, Yang Long
Copyright year: 2008
Abstract: In the past only critical clock circuits are running at high speed but this is no longer true in today high-speed digital design world. Most of the digital traces on board are running at speed in excess of 200 MHz and drivers output with rise time less than 1 ns. Due to constraints of board size and highly complex designs, trace bends and inter-layer transitions through vias are unavoidable. This paper carries out a comprehensive study on the impacts of bends and ground return vias optimisation on signal integrity performance using a full-wave electromagnetic simulator. (CST Microwave Studio). This study will provide high-speed digital designers an in-depth assessment of these effects in high-speed GHz applications so that some design guides to avoid these effects can be established.
Subject: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging.
Type: Conference Paper
Conference name: Asia-Pacific Symposium on Electromagnetic Compatibility and International Zurich Symposium on Electromagnetic Compatibility (19th : 2008 : Singapore)
School: School of Electrical and Electronic Engineering
Related Organization: Guided Systems Division, DSO National Laboratories
Rights: © 2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
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