mirage

Requirement for accurate interconnect temperature measurement for electromigration test

DSpace/Manakin Repository

 

Search DR-NTU


Advanced Search Subject Search

Browse

My Account

Requirement for accurate interconnect temperature measurement for electromigration test

Show full item record

Title: Requirement for accurate interconnect temperature measurement for electromigration test
Author: Hou, Yuejin; Tan, Cher Ming
Copyright year: 2009
Abstract: In this work, we show accurate temperature measurement is important in electromigration (EM) test as it can affect the measured activation energy EA and current density exponent n. The deviation of measured EA and n due to the interconnect temperature variations are derived analytically and illustrated in Cu/low-k interconnects using finite element analysis (FEA) under typical experimental conditions. The derived formulations are verified by our previous experimental works.
Subject: DRNTU::Engineering::Electrical and electronic engineering::Electronic systems.
Type: Conference Paper
Conference name: IEEE International Symposium on Integrated Circuits (12th : 2009 : Singapore)
School: School of Electrical and Electronic Engineering
Rights: © 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
Version: Published version

Files in this item

Files Size Format View
Requirement for ... Electromigration test.pdf 500.3Kb PDF View/Open
   

SFX Query

- Get published version (via NTU subscribed resources)
   

This item appears in the following Collection(s)

Show full item record

Statistics

Total views

All Items Views
Requirement for accurate interconnect temperature measurement for electromigration test 424

Total downloads

All Bitstreams Views
Requirement for accurate interconnect temperature measurement for Electromigration test.pdf 146

Top country downloads

Country Code Views
United States of America 57
Singapore 26
China 23
Russian Federation 7
United Kingdom 4

Top city downloads

city Views
Mountain View 45
Singapore 26
Beijing 13
Hubli 3
London 2

Downloads / month

  2014-06 2014-07 2014-08 total
Requirement for accurate interconnect temperature measurement for Electromigration test.pdf 0 0 7 7