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Requirement for accurate interconnect temperature measurement for electromigration test.

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Requirement for accurate interconnect temperature measurement for electromigration test.

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dc.contributor.author Hou, Yuejin.
dc.contributor.author Tan, Cher Ming.
dc.date.accessioned 2010-09-02T07:18:05Z
dc.date.available 2010-09-02T07:18:05Z
dc.date.copyright 2009
dc.date.issued 2010-09-02T07:18:05Z
dc.identifier.citation Hou, Y., & Tan, C. M. (2009). Requirement for accurate interconnect temperature measurement for electromigration test. In proceedings of the 12th International Symposium on Integrated Circuits: Singapore, (pp.522-525).
dc.identifier.uri http://hdl.handle.net/10220/6394
dc.description.abstract In this work, we show accurate temperature measurement is important in electromigration (EM) test as it can affect the measured activation energy EA and current density exponent n. The deviation of measured EA and n due to the interconnect temperature variations are derived analytically and illustrated in Cu/low-k interconnects using finite element analysis (FEA) under typical experimental conditions. The derived formulations are verified by our previous experimental works.
dc.format.extent 4 p.
dc.language.iso en
dc.rights © 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
dc.subject DRNTU::Engineering::Electrical and electronic engineering::Electronic systems.
dc.title Requirement for accurate interconnect temperature measurement for electromigration test.
dc.type Conference Paper
dc.contributor.conference IEEE International Symposium on Integrated Circuits (12th : 2009 : Singapore)
dc.contributor.school School of Electrical and Electronic Engineering
dc.identifier.openurl http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=5403696
dc.description.version Published version

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