| dc.contributor.author |
Hou, Yuejin. |
| dc.contributor.author |
Tan, Cher Ming. |
| dc.date.accessioned |
2010-09-02T07:18:05Z |
| dc.date.available |
2010-09-02T07:18:05Z |
| dc.date.copyright |
2009 |
| dc.date.issued |
2010-09-02T07:18:05Z |
| dc.identifier.citation |
Hou, Y., & Tan, C. M. (2009). Requirement for accurate interconnect temperature measurement for electromigration test. In proceedings of the 12th International Symposium on Integrated Circuits: Singapore, (pp.522-525). |
| dc.identifier.uri |
http://hdl.handle.net/10220/6394 |
| dc.description.abstract |
In this work, we show accurate temperature
measurement is important in electromigration (EM) test as it can
affect the measured activation energy EA and current density
exponent n. The deviation of measured EA and n due to the
interconnect temperature variations are derived analytically and
illustrated in Cu/low-k interconnects using finite element analysis
(FEA) under typical experimental conditions. The derived
formulations are verified by our previous experimental works. |
| dc.format.extent |
4 p. |
| dc.language.iso |
en |
| dc.rights |
© 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. |
| dc.subject |
DRNTU::Engineering::Electrical and electronic engineering::Electronic systems. |
| dc.title |
Requirement for accurate interconnect temperature measurement for electromigration test. |
| dc.type |
Conference Paper |
| dc.contributor.conference |
IEEE International Symposium on Integrated Circuits (12th:2009:Singapore) |
| dc.contributor.school |
School of Electrical and Electronic Engineering |
| dc.identifier.openurl |
http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=5403696 |
| dc.description.version |
Published version |
