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Transient electrical thermal analysis of ESD process using 3-D finite element method

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Transient electrical thermal analysis of ESD process using 3-D finite element method

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dc.contributor.author Hou, Yuejin
dc.contributor.author Tan, Cher Ming
dc.date.accessioned 2010-09-02T07:26:29Z
dc.date.available 2010-09-02T07:26:29Z
dc.date.copyright 2009
dc.date.issued 2010-09-02T07:26:29Z
dc.identifier.citation Hou, Y., & Tan, C. M. (2009). Transient electrical thermal analysis of ESD process using 3-D finite element method. In proceedings of the 12th International Symposium on Integrated Circuits: Singapore, (pp.129-132).
dc.identifier.uri http://hdl.handle.net/10220/6395
dc.description.abstract In this work, the transient electrical-thermal response of a simple ESD protection circuit to excessive current during an electrostatic discharge (ESD) event is investigated numerically, using 3-D finite element analysis (FEA). The 3-D transient temperature distribution in the circuit can be revealed and the fusing phenomenon of interconnection is captured during the ESD process using human body model (HBM). The method in this work provides a quantitative approach to study the ESD damaging process in the future.
dc.format.extent 4 p.
dc.language.iso en
dc.rights © 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
dc.subject DRNTU::Engineering::Electrical and electronic engineering::Control and instrumentation.
dc.title Transient electrical thermal analysis of ESD process using 3-D finite element method
dc.type Conference Paper
dc.contributor.conference IEEE International Symposium on Integrated Circuits (12th : 2009 : Singapore)
dc.contributor.research Singapore Institute of Manufacturing Technology
dc.contributor.school School of Electrical and Electronic Engineering
dc.identifier.openurl http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=5403933
dc.description.version Published version

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