| dc.contributor.author |
Hou, Yuejin. |
| dc.contributor.author |
Tan, Cher Ming. |
| dc.date.accessioned |
2010-09-02T07:26:29Z |
| dc.date.available |
2010-09-02T07:26:29Z |
| dc.date.copyright |
2009 |
| dc.date.issued |
2010-09-02T07:26:29Z |
| dc.identifier.citation |
Hou, Y., & Tan, C. M. (2009). Transient electrical thermal analysis of ESD process using 3-D finite element method. In proceedings of the 12th International Symposium on Integrated Circuits: Singapore, (pp.129-132). |
| dc.identifier.uri |
http://hdl.handle.net/10220/6395 |
| dc.description.abstract |
In this work, the transient electrical-thermal
response of a simple ESD protection circuit to excessive current
during an electrostatic discharge (ESD) event is investigated
numerically, using 3-D finite element analysis (FEA). The 3-D
transient temperature distribution in the circuit can be revealed
and the fusing phenomenon of interconnection is captured
during the ESD process using human body model (HBM). The
method in this work provides a quantitative approach to study
the ESD damaging process in the future. |
| dc.format.extent |
4 p. |
| dc.language.iso |
en |
| dc.rights |
© 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. |
| dc.subject |
DRNTU::Engineering::Electrical and electronic engineering::Control and instrumentation. |
| dc.title |
Transient electrical thermal analysis of ESD process using 3-D finite element method. |
| dc.type |
Conference Paper |
| dc.contributor.conference |
IEEE International Symposium on Integrated Circuits (12th:2009:Singapore) |
| dc.contributor.research |
Singapore Institute of Manufacturing Technology |
| dc.contributor.school |
School of Electrical and Electronic Engineering |
| dc.identifier.openurl |
http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=5403933 |
| dc.description.version |
Published version |
