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Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications

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Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications

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Title: Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications
Author: Made, Riko I.; Gan, Chee Lip; Yan, Li Ling; Yu, Aibin; Yoon, Seung Wook; Lau, John H.; Lee, Chengkuo
Copyright year: 2009
Abstract: Low-temperature solders have wide applications in integrated circuits and micro-electromechanical systems packaging. In this article, a study on Ag-In solder for chip-to-chip thermocompression bonding was carried out. The resulting joint consists of AgIn2 and Ag9In4 phases, with the latter phase having a melting temperature higher than 400 C. Complete consumption of In solder into a Ag-rich intermetallic compound is achieved by applying a bond pressure of 1.4 MPa at 180 C for 40 min. We also observe that the bonding pressure effect enables a Ag-rich phase to be formed within a shorter bonding duration (10 min) at a higher pressure of 1.6 MPa. Finally, prolonged aging leads to the formation of the final phase of Ag9In4 in the bonded joints.
Subject: DRNTU::Engineering::Materials::Electronic packaging materialsDRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
Type: Journal Article
Series/ Journal Title: Journal of electronic materials
School: School of Materials Science and Engineering
Related Organization: Institute of Microelectronics Singapore
Rights: © 2008 TMS.

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