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Title:
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Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications.
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Author:
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Made, Riko I.; Gan, Chee Lip.; Yan, Li Ling.; Yu, Aibin.; Yoon, Seung Wook.; Lau, John H.; Lee, Chengkuo.
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Copyright year:
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2008 |
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Abstract:
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Low-temperature solders have wide applications in integrated circuits and
micro-electromechanical systems packaging. In this article, a study on Ag-In
solder for chip-to-chip thermocompression bonding was carried out. The
resulting joint consists of AgIn2 and Ag9In4 phases, with the latter phase
having a melting temperature higher than 400 C. Complete consumption of In
solder into a Ag-rich intermetallic compound is achieved by applying a bond
pressure of 1.4 MPa at 180 C for 40 min. We also observe that the bonding
pressure effect enables a Ag-rich phase to be formed within a shorter bonding
duration (10 min) at a higher pressure of 1.6 MPa. Finally, prolonged aging
leads to the formation of the final phase of Ag9In4 in the bonded joints. |
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Subject:
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DRNTU::Engineering::Materials::Electronic packaging materials.
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films.
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Type:
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Journal Article |
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Series/ Journal Title:
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Journal of electronic materials |
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School:
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School of Materials Science and Engineering |
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Related Organization:
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Institute of Microelectronics Singapore |
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Rights:
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© 2008 TMS. |
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Version:
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Accepted version |
