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Study of direct nanoimprinting processes by molecular dynamics simulations.

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Study of direct nanoimprinting processes by molecular dynamics simulations.

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dc.contributor.author Pei, Qing Xiang.
dc.contributor.author Liu, Zi Shun.
dc.contributor.author Zhang, Yong Wei.
dc.contributor.author Dong, Zhili.
dc.date.accessioned 2012-03-09T04:32:23Z
dc.date.available 2012-03-09T04:32:23Z
dc.date.copyright 2010
dc.date.issued 2012-03-09
dc.identifier.citation Pei, Q. X., Liu, Z. S., Zhang, Y. W., & Dong, Z. L. (2010). Study of direct nanoimprinting processes by molecular dynamics simulations. Journal of Computational and Theoretical Nanoscience, 7(10), 2144-2150.
dc.identifier.uri http://hdl.handle.net/10220/7632
dc.description.abstract The direct nanoimprinting process between a diamond mold and a copper substrate is studied using molecular dynamics simulations with embedded atom method potential. The deformation behavior, dislocation movement and imprint force are investigated. For the three imprint surfaces of (0 0 1), (1 1 0) and (1 1 1), it is found that the (0 0 1) surface results in the lowest imprint force, while the (1 1 1) surface results in the highest one. When imprinting on the (0 0 1) surface, the dislocations glide in an angle of about 45° to the imprint direction. In contrast, the dislocations move in parallel or normal to the imprint direction when imprinting on the (1 1 0) surface. For imprinting on the (1 1 1) surface, the dislocations glide in a small angle or normal to the imprint direction. The mold taper angle has little effect on the dislocation moving directions, though it has strong influence on the substrate deformation and imprint forces.
dc.format.extent 6 p.
dc.language.iso en
dc.relation.ispartofseries Journal of computational and theoretical nanoscience
dc.rights © 2010 American Scientific Publishers
dc.subject DRNTU::Engineering::Materials.
dc.title Study of direct nanoimprinting processes by molecular dynamics simulations.
dc.type Journal Article
dc.contributor.school School of Materials Science and Engineering
dc.identifier.doi http://dx.doi.org/10.1166/jctn.2010.1597

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