|
Title:
|
Self-assembled monolayers for reduced temperature direct metal thermocompression bonding.
|
|
Author:
|
Ang, X. F.; Li, F. Y.; Tan, W. L.; Chen, Z.; Wong, Chee C.; Wei, J.
|
|
Copyright year:
|
2007 |
|
Abstract:
|
A reduction in the bonding temperature required for direct gold-gold (Au–Au) thermocompression
bonding is observed by coating a monolayer of dodecanethiol on gold surfaces prior to bonding. The
results show that Au–Au bonded joints of 26.9 g per bump strength can be achieved at a temperature
as low as 160 °C. The temperature drop becomes more apparent when both coated and blank gold
samples are exposed in air over some time before bonding. The authors propose that self-assembled
monolayers passivate metal surface by obviating the adsorption of surface contaminants, in
particular, carbon and oxygen but get desorbed just before bonding takes place. |
|
Subject:
|
DRNTU::Engineering::Materials. |
|
Type:
|
Journal Article |
|
Series/ Journal Title:
|
Applied physics letters |
|
School:
|
School of Materials Science and Engineering |
|
Rights:
|
© 2007 American Institute of Physics. This paper was published in Applied Physics Letters and is made available as an electronic reprint (preprint) with permission of American Institute of Physics. The paper can be found at the following DOI: http://dx.doi.org/10.1063/1.2768869. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law. |
|
Version:
|
Published version |
