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The strength of the silicon die in flip-chip assemblies

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The strength of the silicon die in flip-chip assemblies

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dc.contributor.author Cotterell, Brian
dc.contributor.author Chen, Z.
dc.contributor.author Han, J. B.
dc.contributor.author Tan, N. X.
dc.date.accessioned 2012-04-11T01:06:11Z
dc.date.available 2012-04-11T01:06:11Z
dc.date.copyright 2003
dc.date.issued 2012-04-11
dc.identifier.citation Cotterell, B., Chen, Z., Han, J. B., & Tan, N. X. (2003). The Strength of the Silicon Die in Flip Chip Assemblies. Journal of Electronic Packaging, 125(1), 114-119.
dc.identifier.uri http://hdl.handle.net/10220/7710
dc.description.abstract The mechanical reliability of silicon dies is affected by the defects introduced by surface grinding and edge dicing. The ring-on-ring and the four-point-bend test have been used in this study to separate the distribution in strength for these two types of defect. At low probabilities of failure, it is the "strength" of the edge defects that dominate the reliability. However, if the edges of the die are only lightly stressed compared with the surface, edge defects are unlikely to cause fracture. In this case the use of the four-point-bend test, which is sensitive to both edge and surface defects, will result in an underestimate of the reliability and if only one test is to be performed the ring-on-ring test is preferable to the four-point-bend test. Generally, for a full reliability estimate, the distributions of both types of defect need to be determined.
dc.language.iso en
dc.relation.ispartofseries Journal of electronic packaging
dc.rights © 2003 by ASME
dc.subject DRNTU::Engineering::Materials
dc.title The strength of the silicon die in flip-chip assemblies
dc.type Journal Article
dc.contributor.school School of Materials Science and Engineering
dc.identifier.doi http://dx.doi.org/10.1115/1.1535934

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