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A procedure for the motion of particle-encapsulated droplets in microchannels

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A procedure for the motion of particle-encapsulated droplets in microchannels

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Title: A procedure for the motion of particle-encapsulated droplets in microchannels
Author: Yap, Yit Fatt; Chai, J. C.; Wong, Teck Neng; Nguyen, Nam-Trung; Toh, Kok Chuan; Zhang, H. Y.; Yobas, Levent
Copyright year: 2008
Abstract: A fixed-grid approach for modeling the motion of a particle-encapsulated droplet carried by a pressure-driven immiscible carrier fluid in a microchannel is presented. Three phases (the carrier fluid, the droplet, and the particle) and two different moving boundaries (the droplet–carrier fluid and droplet–particle interfaces) are involved. This is a moving-boundaries problem with the motion of the three phases strongly coupled. In the present article, the particle is assumed to be a fluid of high viscosity and constrained to move with rigid body motion. A combined formulation using one set of governing equations to treat the three phases is employed. The droplet–carrier fluid interface is represented and evolved using a level-set method with a mass-correction scheme. Surface tension is modeled using the continuum surface force model. An additional signed distance function is employed to define the droplet–particle interface. Its evolution is determined from the particle motion governed by the Newton-Euler equations. The governing equations are solved numerically using a finite-volume method on a fixed Cartesian grid. For demonstration purposes, the flows of particle-encapsulated droplets through a constricted microchannel and through a microchannel system are presented.
Subject: DRNTU::Engineering::Mechanical engineering.
Type: Journal Article
Series/ Journal Title: Numerical heat transfer, part B: fundamentals: an international journal of computation and methodology
School: School of Mechanical and Aerospace Engineering
Rights: © 2008 Taylor & Francis Group, LLC. This is the author created version of a work that has been peer reviewed and accepted for publication by Numerical heat transfer, part B: fundamentals: an international journal of computation and methodology, Taylor & Francis Group, LLC. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at [DOI: http://dx.doi.org/10.1080/10407790701632485].
Version: Accepted version

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