On the morphological changes of Ni- and Ni(Pt)-silicides

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On the morphological changes of Ni- and Ni(Pt)-silicides

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dc.contributor.author Lee, Pooi See
dc.contributor.author Pey, Kin Leong
dc.contributor.author Mangelinck, D.
dc.contributor.author Chi, Dong Zhi
dc.contributor.author Osipowicz, T.
dc.date.accessioned 2012-05-18T07:55:32Z
dc.date.available 2012-05-18T07:55:32Z
dc.date.copyright 2005
dc.date.issued 2012-05-18
dc.identifier.citation Lee, P. S., Pey, K. L., Mangelick, D., Chi, D. Z., & Osipowicz, T. (2005). On the morphological changes of Ni- and Ni(Pt)-silicides. Journal of The Electrochemical Society, 152(4), G305-G308.
dc.identifier.uri http://hdl.handle.net/10220/8103
dc.description.abstract The issue of agglomeration and layer inversion has remained critical because conductivity of thin silicide films is sensitive to the degradation of the film morphology. The purpose of this work is to study the morphology degradation that includes agglomeration and layer inversion of NiSi and Ni(Pt)Si. Agglomeration was observed to be preceded by holes evolution. It was found that the addition of Pt has led to improvement in the agglomeration behavior of NiSi but have little influence on the layer inversion when the amount of Pt is 5 atom % in Ni(Pt) on the undoped poly-Si. Increasing the Pt concentration to about 10% shows improvement in the layer inversion behavior compared to 5% Pt. The agglomeration behavior and layer inversion with the addition of the Pt are discussed in terms of the controlling factors of grain boundary energy, interface energies, and nature of the silicide formed. The improved agglomeration associated with Pt addition is attributed to a lower interfacial energy leading to lower grain boundary mobility and reduced driving force for hole evolutions. In addition, suppression of layer inversion can be attained by silicidation with the use of thin Ni(Pt) (~10 nm).
dc.format.extent 4 p.
dc.language.iso en
dc.relation.ispartofseries Journal of the electrochemical society
dc.rights © 2005 The Electrochemical Society. This paper was published in Journal of The Electrochemical Society and is made available as an electronic reprint (preprint) with permission of The Electrochemical Society. The paper can be found at the following official URL: http://dx.doi.org/ 10.1149/1.1862255. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.
dc.subject DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
dc.title On the morphological changes of Ni- and Ni(Pt)-silicides
dc.type Journal Article
dc.contributor.school School of Materials Science and Engineering
dc.identifier.doi http://dx.doi.org/ 10.1149/1.1862255
dc.description.version Published version

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