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Interfacial reaction between Sn-rich solders and Ni-based metallization

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Interfacial reaction between Sn-rich solders and Ni-based metallization

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dc.contributor.author He, Min
dc.contributor.author Kumar, A.
dc.contributor.author Yeo, P. T.
dc.contributor.author Qi, Guojun
dc.contributor.author Chen, Zhong
dc.date.accessioned 2012-05-28T04:26:21Z
dc.date.available 2012-05-28T04:26:21Z
dc.date.copyright 2004
dc.date.issued 2012-05-28
dc.identifier.citation He, M., Kumar, A., Yeo, P. T., Qi, G., & Chen, Z. (2004). Interfacial reaction between Sn-rich solders and Ni-based metallization. Thin Solid Films, 462-463, 387-394.
dc.identifier.uri http://hdl.handle.net/10220/8149
dc.description.abstract Solid state reaction between Sn-rich solders (Sn–3.5Ag and Sn–37Pb) and two types of Ni-based metallization (electroless Ni–P and sputtered Ni) has been studied. The growth rates of the main intermetallic compound (IMC), Ni3Sn4, at different aging temperatures are obtained and the activation energy calculated. Ni3Sn4 grows faster with Sn–3.5Ag solder than with Sn–37Pb solder under the same aging condition. The activation energy for the IMC growth with Ni–P metallization is higher than that with sputtered Ni metallization. Kirkendall voids are found inside Ni3P layer after thermal aging in the solder/Ni–P UBM systems. This is the result of unbalanced element diffusion in solid state reaction between Sn-rich solders and Ni–P metallization. No voids are formed in solder/Ni system.
dc.format.extent 27 p.
dc.language.iso en
dc.relation.ispartofseries Thin solid films
dc.rights © 2004 Elsevier. This is the author created version of a work that has been peer reviewed and accepted for publication by Thin Solid Films, Elsevier. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.tsf.2004.05.062].
dc.subject DRNTU::Engineering::Materials
dc.title Interfacial reaction between Sn-rich solders and Ni-based metallization
dc.type Journal Article
dc.contributor.school School of Materials Science and Engineering
dc.identifier.doi http://dx.doi.org/10.1016/j.tsf.2004.05.062
dc.description.version Accepted version

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