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Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization

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Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization

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dc.contributor.author He, Min
dc.contributor.author Chen, Zhong
dc.contributor.author Qi, Guojun
dc.contributor.author Wong, Chee C.
dc.contributor.author Mhaisalkar, Subodh Gautam
dc.date.accessioned 2012-05-28T07:58:27Z
dc.date.available 2012-05-28T07:58:27Z
dc.date.copyright 2004
dc.date.issued 2012-05-28
dc.identifier.citation He, M., Chen, Z., Qi, G., Wong, C. C., & Mhaisalkar, S. G. (2004). Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization. Thin solid films, 462-463, 363-369.
dc.identifier.uri http://hdl.handle.net/10220/8155
dc.description.abstract Cooling rate is an important parameter in solder reflow process because it influences not only microstructure of solder alloy but also the morphology and growth of intermetallic compounds (IMC) formed between solder and its metallization. All these ultimately affect the mechanical integrity of the joint. In this work, the effect of cooling rate on IMC growth is studied in Sn–3.5 Ag solder/Ni–P under bump metallization (UBM) system. Morphology and growth kinetics of the formed Ni3Sn4 IMC under different cooling rates are studied. Needle-type, boomerang-type and chunk-type of Ni3Sn4 IMCs have been observed between solder and Ni–P UBM under various cooling conditions. The amount of the needle-type and boomerang-type grains decreases with the increase of reflow time. Prolonged reflow results in continuous layer of chunk-type IMC grains with no obvious effect from the cooling rate. Samples with different post-reflow cooling rate are further annealed. It is found that the IMC layer thickness increases faster in samples under fast cooling rate than the slow ones under the same annealing condition.
dc.format.extent 24 p.
dc.language.iso en
dc.relation.ispartofseries Thin solid films
dc.rights © 2004 Elsevier. This is the author created version of a work that has been peer reviewed and accepted for publication by Thin Solid Films, Elsevier. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.tsf.2004.05.045].
dc.subject DRNTU::Engineering::Materials
dc.title Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization
dc.type Journal Article
dc.contributor.school School of Materials Science and Engineering
dc.identifier.doi http://dx.doi.org/10.1016/j.tsf.2004.05.045
dc.description.version Accepted version

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