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A mechanical assessment of flexible optoelectronic devices

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A mechanical assessment of flexible optoelectronic devices

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dc.contributor.author Chen, Zhong
dc.contributor.author Cotterell, Brian
dc.contributor.author Wang, Wei
dc.contributor.author Guenther, Ewald
dc.contributor.author Chua, Soo Jin
dc.date.accessioned 2012-05-28T09:05:28Z
dc.date.available 2012-05-28T09:05:28Z
dc.date.copyright 2001
dc.date.issued 2012-05-28
dc.identifier.citation Chen, Z., Cotterell, B., Wang, W., Guenther, E., & Chua, S. J. (2001). A mechanical assessment of flexible optoelectronic devices. Thin solid films, 394(1-2), 201-205.
dc.identifier.uri http://hdl.handle.net/10220/8159
dc.description.abstract This work has demonstrated novel experimental methods and their relevant analysis to evaluate the fracture properties of thin brittle films on compliant substrates for flexible optoelectronic devices. Based on the understanding of the failure mechanisms, mechanical calculation has been provided to estimate the thin film fracture toughness and film delamination toughness. These values serve as design parameters on the device flexibility and reliability.
dc.format.extent 18 p.
dc.language.iso en
dc.relation.ispartofseries Thin solid films
dc.rights © 2001 Elsevier Science B.V. This is the author created version of a work that has been peer reviewed and accepted for publication by Thin Solid Films, Elsevier Science B.V. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: DOI: [http://dx.doi.org/10.1016/S0040-6090(01)01138-5].
dc.subject DRNTU::Engineering::Materials.
dc.title A mechanical assessment of flexible optoelectronic devices
dc.type Journal Article
dc.contributor.school School of Materials Science and Engineering
dc.identifier.doi http://dx.doi.org/10.1016/S0040-6090(01)01138-5
dc.description.version Accepted version

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