mirage

Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits

DSpace/Manakin Repository

 

Search DR-NTU


Advanced Search Subject Search

Browse

My Account

Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits

Show simple item record

dc.contributor.author Made, Riko I.
dc.contributor.author Gan, Chee Lip
dc.contributor.author Yan, Li Ling
dc.contributor.author Kor, Katherine Hwee Boon
dc.contributor.author Chia, Hong Ling
dc.contributor.author Pey, Kin Leong
dc.contributor.author Thompson, Carl V.
dc.date.accessioned 2012-05-29T07:54:52Z
dc.date.available 2012-05-29T07:54:52Z
dc.date.copyright 2012
dc.date.issued 2012-05-29
dc.identifier.citation Made, R. I., Gan, C. L., Yan, L., Kor, K. H. B., Chia, H. L., Pey, K. L., et al. (2012). Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits. Acta Materialia, 60(2), 578–587.
dc.identifier.uri http://hdl.handle.net/10220/8174
dc.description.abstract An analytical model is proposed which relates the bonding temperature, pressure and duration with the integrity of metal–metal thermocompressionbonds. Unlike previous models, this approach takes into account the pressure-dependent time evolution of the thermocompressionbond formation. The model allows calculation of the true contact area of rough surfaces, based on a creep-dominated plastic deformation. Verification of the model was provided through experiments on Cu–Cuthermocompressionbonds of electroplated Cu on diced silicon wafers with chemically/mechanically polished surfaces. The samples were bonded at a range of temperatures, pressures and times. Shear strength measurements were used to characterize the effects of the bonding parameters on the interface bond strength. Calculated true contact area and bond shear strength can be related by a single proportionality factor. The model can be used to predict the thermocompressionbond quality for given bonding parameters and process optimization for reliable bonds, thus assisting in the adoption of the Cuthermocompressionbond process in three-dimensionalintegratedcircuit applications.
dc.format.extent 10 p.
dc.language.iso en
dc.relation.ispartofseries Acta materialia
dc.rights © 2011 Acta Materialia Inc. This is the author created version of a work that has been peer reviewed and accepted for publication in Acta materialia, published by Elsevier on behalf of Acta Materialia Inc. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [DOI: http://dx.doi.org/10.1016/j.actamat.2011.09.038].
dc.subject DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits.
dc.title Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits
dc.type Journal Article
dc.contributor.school School of Materials Science and Engineering
dc.contributor.school School of Electrical and Electronic Engineering
dc.identifier.doi http://dx.doi.org/10.1016/j.actamat.2011.09.038
dc.identifier.rims 166522

Files in this item

Files Size Format View
(Accepted)Acta-Mat-Manuscript-riko_rev_v4-nfc.pdf 1.107Mb PDF View/Open

This item appears in the following Collection(s)

Show simple item record

Statistics

Total views

All Items Views
Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits 314

Total downloads

All Bitstreams Views
(Accepted)Acta-Mat-Manuscript-riko_rev_v4-nfc.pdf 212
Made et al. - 2012 - Experimental characterization and modeling of the .pdf 4

Top country downloads

Country Code Views
United States of America 61
China 57
Singapore 41
Taiwan 15
Germany 10

Top city downloads

city Views
Mountain View 45
Beijing 38
Singapore 37
Taichung 5
Taipei 5

Downloads / month

  2014-09 2014-10 2014-11 total
(Accepted)Acta-Mat-Manuscript-riko_rev_v4-nfc.pdf 0 0 6 6