| dc.contributor.author |
Kor, H. B. |
| dc.contributor.author |
Chang, A. C. K. |
| dc.contributor.author |
Gan, C. L. |
| dc.date.accessioned |
2012-06-01T01:26:04Z |
| dc.date.available |
2012-06-01T01:26:04Z |
| dc.date.copyright |
2010 |
| dc.date.issued |
2012-06-01 |
| dc.identifier.citation |
Kor, H. B., Chang, A. C. K. & Gan, C. L. (2010). Temperature Control with a Thermoelectric Cooler (TEC) during Laser Decapsulation of Plastic Packages. In The 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), pp. 1-6. |
| dc.identifier.uri |
http://hdl.handle.net/10220/8186 |
| dc.description.abstract |
Ablation was carried out on high voltage Schottky rectifiers at 25°C and -5°C (with a thermoelectric cooler or TEC), at 1.0 W and 3.9 W of laser power. In-situ measurement of the reverse current was conducted and correlated to the device junction temperature. It was found that the usage of a TEC increases the number of laser scans to reach the set current compliance of 100 μA after exposing the die, for ablation at 3.9 W, although eventual damage to the device is still unavoidable. The incorporation of a TEC below the sample is also demonstrated to be effective in reducing the device junction temperature during laser ablation. |
| dc.language.iso |
en |
| dc.rights |
© 2010 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: [DOI: http://dx.doi.org/10.1109/IPFA.2010.5531987 ] |
| dc.subject |
DRNTU::Engineering::Materials. |
| dc.title |
Temperature control with a thermoelectric cooler (TEC) during laser decapsulation of plastic packages. |
| dc.type |
Conference Paper |
| dc.contributor.conference |
17th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010) |
| dc.contributor.school |
School of Materials Science and Engineering |
| dc.identifier.doi |
http://dx.doi.org/10.1109/IPFA.2010.5531987 |
