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Temperature control with a thermoelectric cooler (TEC) during laser decapsulation of plastic packages.

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Temperature control with a thermoelectric cooler (TEC) during laser decapsulation of plastic packages.

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dc.contributor.author Kor, H. B.
dc.contributor.author Chang, A. C. K.
dc.contributor.author Gan, C. L.
dc.date.accessioned 2012-06-01T01:26:04Z
dc.date.available 2012-06-01T01:26:04Z
dc.date.copyright 2010
dc.date.issued 2012-06-01
dc.identifier.citation Kor, H. B., Chang, A. C. K. & Gan, C. L. (2010). Temperature Control with a Thermoelectric Cooler (TEC) during Laser Decapsulation of Plastic Packages. In The 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), pp. 1-6.
dc.identifier.uri http://hdl.handle.net/10220/8186
dc.description.abstract Ablation was carried out on high voltage Schottky rectifiers at 25°C and -5°C (with a thermoelectric cooler or TEC), at 1.0 W and 3.9 W of laser power. In-situ measurement of the reverse current was conducted and correlated to the device junction temperature. It was found that the usage of a TEC increases the number of laser scans to reach the set current compliance of 100 μA after exposing the die, for ablation at 3.9 W, although eventual damage to the device is still unavoidable. The incorporation of a TEC below the sample is also demonstrated to be effective in reducing the device junction temperature during laser ablation.
dc.language.iso en
dc.rights © 2010 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: [DOI: http://dx.doi.org/10.1109/IPFA.2010.5531987 ]
dc.subject DRNTU::Engineering::Materials.
dc.title Temperature control with a thermoelectric cooler (TEC) during laser decapsulation of plastic packages.
dc.type Conference Paper
dc.contributor.conference International Symposium on the Physical and Failure Analysis of Integrated Circuits (17th : 2010 : Singapore)
dc.contributor.school School of Materials Science and Engineering
dc.identifier.doi http://dx.doi.org/10.1109/IPFA.2010.5531987
dc.identifier.rims 160450

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