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Buckling and cracking of thin films on compliant substrates under compression

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Buckling and cracking of thin films on compliant substrates under compression

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dc.contributor.author Cotterell, Brian
dc.contributor.author Chen, Zhong
dc.date.accessioned 2012-06-20T03:51:06Z
dc.date.available 2012-06-20T03:51:06Z
dc.date.copyright 2000
dc.date.issued 2012-06-20
dc.identifier.citation Cotterell, B., & Chen, Z. (2000). Buckling and Cracking of Thin Films on Compliant Substrate under Compression. International Journal of Fracture, 104(2), 169-179.
dc.identifier.uri http://hdl.handle.net/10220/8214
dc.description.abstract It is shown that unless the substrate is at least as stiff as the film, the energy stored in the substrate contributes significantly to the energy release rate of film delamination under compression either with or without cracking. For very compliant substrates, such as polyethylene terephthalate (PET) with a indium tin oxide (ITO) film, the energy release rate allowing for the deformation of the substrate can be more than an order of magnitude greater than the value obtained neglecting the substrate's deformation. The argument that buckling delaminations tunnel at the tip rather than spread sideways because of increase in mode-mixity may need modification; it is still true for stiff substrates, but for compliant substrates the average energy release rate decreases with delamination width and the limitation in buckled width may be due to this stability as much as the increase in mode-mixity.
dc.language.iso en
dc.relation.ispartofseries International journal of fracture
dc.rights © 2000 Kluwer Academic Publishers. This is the author created version of a work that has been peer reviewed and accepted for publication by International Journal of Fracture, Kluwer Academic Publishers. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1023/A:1007628800620].
dc.subject DRNTU::Engineering::Materials
dc.title Buckling and cracking of thin films on compliant substrates under compression
dc.type Journal Article
dc.contributor.school School of Materials Science and Engineering
dc.identifier.doi http://dx.doi.org/10.1023/A:1007628800620
dc.description.version Accepted version

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