| dc.contributor.author |
Xu, H. |
| dc.contributor.author |
Liu, C. |
| dc.contributor.author |
Silberschmidt, V. V. |
| dc.contributor.author |
Chen, Z. |
| dc.contributor.author |
Wei, J. |
| dc.contributor.author |
Sivakumar, M. |
| dc.date.accessioned |
2012-06-27T02:57:34Z |
| dc.date.available |
2012-06-27T02:57:34Z |
| dc.date.copyright |
2010 |
| dc.date.issued |
2012-06-27 |
| dc.identifier.citation |
Xu, H., Liu, C., Silberschmidt, V. V., Chen, Z., Wei, J., & Sivakumar, M. (2011). Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: a TEM study of interfacial evolution. Microelectronics Reliability, 51(1), 113-118. |
| dc.identifier.issn |
0026-2714 |
| dc.identifier.uri |
http://hdl.handle.net/10220/8242 |
| dc.description.abstract |
The effect of bonding duration and substrate temperature on the nano-scale interfacial structure for
bonding strength were investigated using high resolution transmission electron microscopy. It shows
that intermetallic compound crystallization correlates with bonding duration, as a longer duration is
applied, alumina fragmentation becomes pervasive, resulting in continuous alloy interfaces and robust
bonds. In addition, a substrate temperature (i.e. 175 C) promotes the fracture of alumina, and simultaneously
contributes to the interfacial temperature, accelerating interdiffusion and facilitating the formation
of intermetallic compounds, therefore increasing bonding strength. The compound formed during
bonding is CuAl2, regardless of the bonding parameters applied. |
| dc.language.iso |
en |
| dc.relation.ispartofseries |
Microelectronics reliability |
| dc.rights |
© 2010 Elsevier.
This is the author created version of a work that has been peer reviewed and accepted for publication by Microelectronics Reliability, Elsevier. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.microrel.2010.03.016]. |
| dc.subject |
DRNTU::Engineering::Materials. |
| dc.title |
Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads : a TEM study of interfacial evolution. |
| dc.type |
Journal Article |
| dc.contributor.school |
School of Materials Science and Engineering |
| dc.identifier.doi |
http://dx.doi.org/10.1016/j.microrel.2010.03.016 |
| dc.description.version |
Accepted version |
