mirage

Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads : a TEM study of interfacial evolution

DSpace/Manakin Repository

 

Search DR-NTU


Advanced Search Subject Search

Browse

My Account

Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads : a TEM study of interfacial evolution

Show simple item record

dc.contributor.author Xu, Hui
dc.contributor.author Liu, Changqing
dc.contributor.author Silberschmidt, Vadim V.
dc.contributor.author Chen, Z.
dc.contributor.author Wei, J.
dc.contributor.author Sivakumar, M.
dc.date.accessioned 2012-06-27T02:57:34Z
dc.date.available 2012-06-27T02:57:34Z
dc.date.copyright 2010
dc.date.issued 2012-06-27
dc.identifier.citation Xu, H., Liu, C., Silberschmidt, V. V., Chen, Z., Wei, J., & Sivakumar, M. (2011). Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: a TEM study of interfacial evolution. Microelectronics reliability, 51(1), 113-118.
dc.identifier.issn 0026-2714
dc.identifier.uri http://hdl.handle.net/10220/8242
dc.description.abstract The effect of bonding duration and substrate temperature on the nano-scale interfacial structure for bonding strength were investigated using high resolution transmission electron microscopy. It shows that intermetallic compound crystallization correlates with bonding duration, as a longer duration is applied, alumina fragmentation becomes pervasive, resulting in continuous alloy interfaces and robust bonds. In addition, a substrate temperature (i.e. 175 C) promotes the fracture of alumina, and simultaneously contributes to the interfacial temperature, accelerating interdiffusion and facilitating the formation of intermetallic compounds, therefore increasing bonding strength. The compound formed during bonding is CuAl2, regardless of the bonding parameters applied.
dc.language.iso en
dc.relation.ispartofseries Microelectronics reliability
dc.rights © 2010 Elsevier. This is the author created version of a work that has been peer reviewed and accepted for publication by Microelectronics Reliability, Elsevier. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.microrel.2010.03.016].
dc.subject DRNTU::Engineering::Materials
dc.title Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads : a TEM study of interfacial evolution
dc.type Journal Article
dc.contributor.school School of Materials Science and Engineering
dc.identifier.doi http://dx.doi.org/10.1016/j.microrel.2010.03.016
dc.description.version Accepted version

Files in this item

Files Size Format View
16. Effect of b ... in copper ball bonding.pdf 882.8Kb PDF View/Open

This item appears in the following Collection(s)

Show simple item record

Statistics

Total views

All Items Views
Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads : a TEM study of interfacial evolution 267

Total downloads

All Bitstreams Views
16. Effect of bonding duration and substrate temperature in copper ball bonding.pdf 344

Top country downloads

Country Code Views
United States of America 116
China 83
France 24
Singapore 23
Taiwan 16

Top city downloads

city Views
Mountain View 61
Beijing 57
Singapore 20
Barrême 14
Seoul 5

Downloads / month

  2014-10 2014-11 2014-12 total
16. Effect of bonding duration and substrate temperature in copper ball bonding.pdf 0 0 6 6