mirage

Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads : a TEM study of interfacial evolution.

DSpace/Manakin Repository

 

Search DR-NTU


Advanced Search Subject Search

Browse

My Account

Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads : a TEM study of interfacial evolution.

Show simple item record

dc.contributor.author Xu, Hui.
dc.contributor.author Liu, Changqing.
dc.contributor.author Silberschmidt, Vadim V.
dc.contributor.author Chen, Z.
dc.contributor.author Wei, J.
dc.contributor.author Sivakumar, M.
dc.date.accessioned 2012-06-27T02:57:34Z
dc.date.available 2012-06-27T02:57:34Z
dc.date.copyright 2010
dc.date.issued 2012-06-27
dc.identifier.citation Xu, H., Liu, C., Silberschmidt, V. V., Chen, Z., Wei, J., & Sivakumar, M. (2011). Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: a TEM study of interfacial evolution. Microelectronics reliability, 51(1), 113-118.
dc.identifier.issn 0026-2714
dc.identifier.uri http://hdl.handle.net/10220/8242
dc.description.abstract The effect of bonding duration and substrate temperature on the nano-scale interfacial structure for bonding strength were investigated using high resolution transmission electron microscopy. It shows that intermetallic compound crystallization correlates with bonding duration, as a longer duration is applied, alumina fragmentation becomes pervasive, resulting in continuous alloy interfaces and robust bonds. In addition, a substrate temperature (i.e. 175 C) promotes the fracture of alumina, and simultaneously contributes to the interfacial temperature, accelerating interdiffusion and facilitating the formation of intermetallic compounds, therefore increasing bonding strength. The compound formed during bonding is CuAl2, regardless of the bonding parameters applied.
dc.language.iso en
dc.relation.ispartofseries Microelectronics reliability
dc.rights © 2010 Elsevier. This is the author created version of a work that has been peer reviewed and accepted for publication by Microelectronics Reliability, Elsevier. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.microrel.2010.03.016].
dc.subject DRNTU::Engineering::Materials.
dc.title Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads : a TEM study of interfacial evolution.
dc.type Journal Article
dc.contributor.school School of Materials Science and Engineering
dc.identifier.doi http://dx.doi.org/10.1016/j.microrel.2010.03.016
dc.description.version Accepted version

Files in this item

Files Size Format View
16. Effect of b ... in copper ball bonding.pdf 882.8Kb PDF View/Open

This item appears in the following Collection(s)

Show simple item record

Statistics

Total views

All Items Views
Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads : a TEM study of interfacial evolution. 221

Total downloads

All Bitstreams Views
16. Effect of bonding duration and substrate temperature in copper ball bonding.pdf 297

Top country downloads

Country Code Views
United States of America 99
China 63
France 23
Singapore 21
Taiwan 15

Top city downloads

city Views
Mountain View 54
Beijing 42
Singapore 18
Barrême 14
Taninges 5