| dc.contributor.author |
Zhang, Hua. |
| dc.contributor.author |
He, Hui-Xin. |
| dc.contributor.author |
Wang, Jian. |
| dc.contributor.author |
Liu, Zhong-Fan. |
| dc.date.accessioned |
2012-09-24T07:41:00Z |
| dc.date.available |
2012-09-24T07:41:00Z |
| dc.date.copyright |
2000 |
| dc.date.issued |
2012-09-24 |
| dc.identifier.citation |
Zhang, H., He, H. X., Wang, J., & Liu, Z. F. (2000). Atomic force microscopy evidence of citrate displacement by 4-mercaptopyridine on gold in aqueous solution. Langmuir, 16(10), 4554-4557. |
| dc.identifier.issn |
0743-7463 |
| dc.identifier.uri |
http://hdl.handle.net/10220/8627 |
| dc.description.abstract |
The displacement adsorption process of 4-mercaptopyridine (4-MP) on trisodium citrate preadsorbed gold surface in aqueous solution was studied using atomic force microscopy (AFM). The measurement was done by monitoring the interaction force between a gold-coated AFM tip and a gold substrate, both presaturated by trisodium citrate. The addition of 4-MP was found to result in a remarkable change of tip−substrate adhesion force, which showed a gradual increase and finally reached a maximum. Using the chemical force titration technique, we estimated the surface pK1/2 of thus-formed 4-MP displacement film and compared with pure 4-MP self-assembled monolayer (SAM) formed on gold in ethanol solution. Our results indicate that the 4-MP molecules are more strongly adsorbed on gold than citrate anions, mostly via Au−S bonding, forming a less dense and mixed displacement film. The displacement adsorption kinetics seems very fast and it takes only ca. 2 min to establish more than 50% surface coverage of 4-MP molecules. |
| dc.language.iso |
en |
| dc.relation.ispartofseries |
Langmuir |
| dc.rights |
© 2000 American Chemical Society. |
| dc.subject |
DRNTU::Engineering::Materials. |
| dc.title |
Atomic force microscopy evidence of citrate displacement by 4-mercaptopyridine on gold in aqueous solution. |
| dc.type |
Journal Article |
| dc.contributor.school |
School of Materials Science and Engineering |
| dc.identifier.doi |
http://dx.doi.org/10.1021/la9904657 |